US2011120987A1PendingUtilityA1
Substrate for a heater assembly and method of manufacture thereof
Est. expiryFeb 20, 2027(~0.6 yrs left)· nominal 20-yr term from priority
Inventors:Richard C. Abbott
Y10T156/10H05B 2203/006C23C 24/04F24H 3/0405H05B 2203/013F24H 3/0411Y10T29/49099F24C 15/325H05B 1/00H05B 3/16F24D 19/04C23C 4/06D06F 58/26H05B 3/10Y02T50/60
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Claims
Abstract
A substrate for a heating assembly comprising a mixture of a mica material with an electrically insulating material, the substrate having a thermal coefficient of expansion that is higher than pure mica. A method of manufacturing the substrate is also disclosed.
Claims
exact text as granted — not AI-modified1 . A method of forming a mica material for a heater assembly, comprising:
mixing a mica material with an electrically insulating material to form a substrate for a heater assembly, the substrate having a thermal coefficient of expansion that is higher than pure mica.
2 . The method of forming a mica material for a heater assembly of claim 1 , wherein the electrically insulating material is aluminum nitride.
3 . The method of forming a mica material for a heater assembly of claim 1 , wherein the electrically insulating material is at least one selected from a group consisting of zirconium oxide, aluminum oxide, and magnesium oxide.
4 . The method of forming a mica material for a heater assembly of claim 1 , wherein the electrically insulating material is a silicate having a higher thermal expansion coefficient than pure mica.
5 . The method of forming a mica material for a heating assembly further comprising mixing the mica material with a powder in which at least one of particle size and binder volume are adjusted yield a roughened surface such that mechanical roughening is not necessary.
6 . A method of forming a heater assembly comprising:
forming substrate of a mica material as in claim 1 ; thermally spraying a material onto the substrate to form a resistive heater layer.
7 . A method of forming a heater assembly as in claim 6 further comprising apply a coating onto the resistive heater layer.
8 . A substrate for a heating assembly comprising a mixture of a mica material with an electrically insulating material, the substrate having a thermal coefficient of expansion that is higher than pure mica.
9 . A substrate for a heating assembly of claim 8 , wherein the electrically insulating material is aluminum nitride.
10 . A substrate for a heating assembly of claim 8 , wherein the electrically insulating material is at least one selected from a group consisting of zirconium oxide, aluminum oxide, and magnesium oxide.
11 . A substrate for a heating assembly of claim 8 , wherein the electrically insulating material is a silicate having a higher thermal expansion coefficient than pure mica.
12 . A substrate for a heating assembly of claim 8 , wherein the mixture further comprises a powder in which at least one of particle size and binder volume are adjusted to yield a roughened surface such that mechanical roughening is not necessary.Join the waitlist — get patent alerts
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