US2011109203A1PendingUtilityA1

Flexible piezoelectric structures and method of making same

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Assignee: UNIV PRINCETONPriority: Nov 6, 2009Filed: Mar 19, 2010Published: May 12, 2011
Est. expiryNov 6, 2029(~3.3 yrs left)· nominal 20-yr term from priority
Inventors:Michael C. McalpineYi Qi
H10W 10/181H10P 90/1924H10P 90/1914Y10T29/49124Y10T29/42A61K 51/1282A61L 31/16H10N 30/883H10N 30/206H10N 30/074H10N 30/704
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Claims

Abstract

A flexible piezoelectric structure and a method of making the structure are disclosed. A piezoelectric film having a relatively high piezoelectric coefficient is attached to a flexible substrate. The piezoelectric film is fabricated on a different substrate and transferred to the flexible substrate by contact.

Claims

exact text as granted — not AI-modified
1 . A flexible piezoelectric structure, comprising:
 a first flexible substrate; and   a first piezoelectric film attached to the flexible substrate.   
     
     
         2 . The flexible piezoelectric structure of  claim 1 , wherein the first piezoelectric film is patterned. 
     
     
         3 . The flexible piezoelectric structure of  claim 2 , wherein the first piezoelectric film is patterned as ribbons having a non-circular cross-section. 
     
     
         4 . The flexible substrate of  claim 1 , wherein the first piezoelectric film comprises an inorganic material. 
     
     
         5 . The flexible piezoelectric structure of  claim 1 , wherein the first piezoelectric film comprises at least one of a non-polymeric material, a non-crystalline material, a partially crystalline material, a polycrystalline material, or a crystalline material. 
     
     
         6 . The flexible piezoelectric structure of  claim 1 , wherein the first piezoelectric film has a piezoelectric coefficient exceeding 26 picoCoulombs/Newton. 
     
     
         7 . The flexible piezoelectric structure of  claim 1 , wherein the first piezoelectric film comprises at least one of PZT, ZnO, Quartz, LiNbO 3 , SrTiO 3 , BaTiO 3 , lead zirconate, or lead titanate. 
     
     
         8 . The flexible piezoelectric structure of  claim 1 , further comprising a second flexible substrate, wherein the first piezoelectric film is encapsulated by the first and second flexible substrates. 
     
     
         9 . The flexible piezoelectric structure of  claim 1  further comprising first and second electrodes in contact with the first piezoelectric film. 
     
     
         10 . The flexible piezoelectric structure of  claim 9 , wherein the first and second electrodes are both in contact with one side of the first piezoelectric film. 
     
     
         11 . The flexible piezoelectric structure of  claim 9 , wherein the first and second electrodes are respectively in contact with opposite sides of the first piezoelectric film. 
     
     
         12 . The flexible piezoelectric structure of  claim 3  further comprising electrode fingers running parallel to the ribbons. 
     
     
         13 . The flexible piezoelectric structure of  claim 3  further comprising electrode fingers running perpendicular to the ribbons. 
     
     
         14 . The flexible piezoelectric structure of  claim 1 , wherein the flexible substrate comprises at least one of: polydimethylsiloxane (PDMS), polyethylene terephthalate (PET), polyether ether ketone (PEEK), a polyimide, or a polyester. 
     
     
         15 . The flexible piezoelectric structure of  claim 1 , further comprising a second piezoelectric film stacked over the first piezoelectric film. 
     
     
         16 . A method for fabricating a flexible piezoelectric structure, comprising:
 depositing a first piezoelectric film on a first substrate;   contacting a flexible substrate with the first piezoelectric film; and   separating the first piezoelectric film and flexible substrate from the first substrate, the first piezoelectric film remaining attached to the flexible substrate.   
     
     
         17 . The method of  claim 16 , further comprising patterning the first piezoelectric film. 
     
     
         18 . The method of  claim 17 , wherein the patterning comprises patterning the first piezoelectric film into ribbons having a non-circular cross-section. 
     
     
         19 . The method of  claim 16 , wherein depositing comprises at least one of sputtering, radio-frequency sputtering, hydrothermal deposition, chemical vapor deposition (CVD), metal-organic CVD, sol-gel deposition, laser ablation, pulsed laser deposition, or molecular beam epitaxy. 
     
     
         20 . The method of  claim 16 , wherein the first piezoelectric film comprises an inorganic material. 
     
     
         21 . The method of  claim 16 , wherein the first piezoelectric film comprises at least one of a non-polymeric material, a non-crystalline material, a partially crystalline material, a polycrystalline material, or a crystalline material. 
     
     
         22 . The method of  claim 16 , wherein the first piezoelectric film comprises a material having a piezoelectric coefficient exceeding 26 picoCoulombs/Newton. 
     
     
         23 . The method of  claim 16 , wherein the first piezoelectric film comprises at least one of: PZT, ZnO, Quartz, LiNbO 3 , SrTiO 3 , BaTiO 3 , lead zirconate, or lead titanate. 
     
     
         24 . The method of  claim 16 , further comprising encapsulating the first piezoelectric film with a second flexible substrate. 
     
     
         25 . The method of  claim 16 , further comprising fabricating first and second electrodes in contact with the first piezoelectric film. 
     
     
         26 . The method of  claim 16 , wherein the first and second electrodes are both fabricated in contact with one side of the first piezoelectric film. 
     
     
         27 . The method of  claim 16 , wherein the first and second electrodes are respectively fabricated in contact with opposite sides of the first piezoelectric film. 
     
     
         28 . The method of  claim 18 , further comprising fabricating electrode fingers running parallel to the ribbons. 
     
     
         29 . The method of  claim 18 , further comprising fabricating electrode fingers running perpendicular to the ribbons. 
     
     
         30 . The method of  claim 16 , wherein the flexible substrate comprises at least one of: polydimethylsiloxane (PDMS), polyethylene terephthalate (PET), polyether ether ketone (PEEK), a polyimide, or a polyester. 
     
     
         31 . The method of  claim 16 , further comprising repeating the depositing, contacting and separating to dispose at least one additional piezoelectric film stacked over the first piezoelectric film.

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