Mounting method and mounting structure for semiconductor package component

Abstract

A semiconductor package component ( 3 ) is mounted on a substrate ( 1 ) in such a manner that an electrode ( 2 ) of the substrate ( 1 ) and an electrode of the semiconductor package component ( 3 ) are brought into contact with each other through a joining material ( 4 ). A reinforcing adhesive ( 5 c ) is applied between the substrate ( 1 ) and the outer surface of the semiconductor package component ( 3 ). Then, reflow is performed to melt the joining metal ( 4 ) with the reinforcing adhesive ( 5 c ) uncured. After the reinforcing adhesive ( 5 c ) is cured, the joining metal ( 4 ) is solidified.

1 . A semiconductor package component mounting method comprising:
 mounting a semiconductor package component on a substrate in such a manner that an electrode of the substrate and an electrode of the semiconductor package component are brought into contact with each other through a solidified joining metal;   applying a reinforcing adhesive between a periphery of an area on the substrate where the semiconductor package component is mounted and an outer surface of the semiconductor package component in such a manner that the reinforcing adhesive does not contact the joining metal; and   performing reflow to melt the joining metal while the reinforcing adhesive is uncured, curing the reinforcing adhesive, and solidifying the joining metal.   
     
     
         2 . The semiconductor package component mounting method according to  claim 1 , wherein, in the applying of the reinforcing adhesive, the reinforcing adhesive is applied so that the reinforcing adhesive extends from a surface of the semiconductor package component opposite a surface facing the substrate to the substrate. 
     
     
         3 . The semiconductor package component mounting method according to  claim 1 , wherein, in the applying of the reinforcing adhesive, the reinforcing adhesive is applied so that the reinforcing adhesive extends from an end face of the semiconductor package component to the substrate, the end face connecting a surface of the semiconductor package component facing the substrate and a surface opposite the surface. 
     
     
         4 . A semiconductor package component mounting structure in which a semiconductor package component is mounted on a substrate by joining an electrode of the substrate to an electrode of the semiconductor package component with a joining metal, the mounting structure comprising:
 a cured reinforcing adhesive which is not in contact with the joining metal, the reinforcing adhesive extending from a surface of the semiconductor package component opposite a surface facing the substrate to the substrate, wherein:   the cured reinforcing adhesive extends over a distance L 1  onto the opposite surface of the semiconductor package component from an end face of the semiconductor package component and extends over a distance L 2  onto the surface of the semiconductor package component facing the substrate from the end face of the semiconductor package component, the end face connecting the surface of the semiconductor package component facing the substrate and the opposite surface; and   the distance L 1  over which the reinforcing adhesive extends onto the opposite surface of the semiconductor package component from the end face connecting the surface of the semiconductor package component facing the substrate and the opposite surface is equal to or greater than the distance L 2  over which the reinforcing adhesive extends onto the surface of the semiconductor package component facing the substrate from the end face of the semiconductor package component.   
     
     
         5 . The semiconductor package component mounting structure according to  claim 4 , wherein the reinforcing adhesive is not in contact with the joining metal. 
     
     
         6 . A semiconductor package component mounting method comprising:
 applying a first reinforcing adhesive to a position on a substrate where a semiconductor package component is to be mounted;   mounting the semiconductor package component on the substrate in such a manner that an electrode of the substrate and an electrode of the semiconductor package component are brought into contact with each other through a solidified joining metal;   applying a second reinforcing adhesive between a periphery of an area on the substrate where the semiconductor package component is mounted and an outer surface of the semiconductor package component; and   performing reflow to melt the joining metal and curing the first and second reinforcing adhesives while the joining metal solidifies.   
     
     
         7 . The semiconductor package component mounting method according to  claim 6 , wherein, in the applying of the second reinforcing adhesive, the second reinforcing adhesive is applied so that the second reinforcing adhesive extends from a surface of the semiconductor package component opposite a surface facing the substrate to the substrate. 
     
     
         8 . The semiconductor package component mounting method according to  claim 6 , wherein, in the applying of the second reinforcing adhesive, the second reinforcing adhesive is applied so that the second reinforcing adhesive extends from an end face of the semiconductor package component to the substrate, the end face connecting a surface of the semiconductor package component facing the substrate and a surface opposite the surface. 
     
     
         9 . A semiconductor package component mounting structure in which a semiconductor package component is mounted on a substrate by joining an electrode of the substrate to an electrode of the semiconductor package component with a joining metal, the mounting structure comprising:
 a cured first reinforcing adhesive disposed between the substrate and a surface of the semiconductor package component facing the substrate; and   a cured second reinforcing adhesive disposed from an end face connecting the surface of the semiconductor package component facing the substrate and an opposite surface of the semiconductor package component to the substrate.   
     
     
         10 . The semiconductor package component mounting structure according to  claim 9 , wherein the first and second reinforcing adhesives are not in contact with the joining metal. 
     
     
         11 . A semiconductor package component mounting structure in which a semiconductor package component is mounted on a substrate by joining an electrode of the substrate to an electrode of the semiconductor package component with a joining metal, the mounting structure comprising:
 a cured first reinforcing adhesive disposed between the substrate and a surface of the semiconductor package component facing the substrate; and   a cured second reinforcing adhesive disposed from a surface of the semiconductor package component opposite the surface facing the substrate to the substrate.   
     
     
         12 . The semiconductor package component mounting structure according to  claim 11 , wherein the first and second reinforcing adhesives are not in contact with the joining metal.