Apparatus and method for plating a substrate

Abstract

An apparatus for electroplating a substrate includes a substrate supporting member that supports the substrate such that a plating surface of the substrate faces upwardly, an anode electrode disposed at an upper part of the substrate supporting member, a power source for applying a voltage to the anode electrode and the substrate, and a plating solution supply member for supplying a plating solution onto the substrate.

1 . An apparatus for electroplating a substrate, comprising:
 a substrate supporting member that supports the substrate such that a plating surface of the substrate faces upwardly;   an anode electrode disposed at an upper part of the substrate supporting member;   a power source for applying a voltage to the anode electrode and the substrate; and   a plating solution supply member for supplying a plating solution onto the substrate.   
     
     
         2 . The apparatus of  claim 1 , wherein the plating solution supply member comprises a plating solution discharge nozzle disposed at an upper part of the anode electrode and discharging downwardly the plating solution in a direction toward the substrate. 
     
     
         3 . The apparatus of  claim 2 , further comprising:
 a plating bath having an opened lower part and accommodating the plating solution discharge nozzle and the anode electrode therein; and   a first driving portion ascending and descending the substrate supporting member such that the opened lower part of the plating bath is opened and closed by the substrate.   
     
     
         4 . The apparatus of  claim 3 , further comprising:
 a ring-shaped contact plate provided at the opened lower part of the plating bath; and   a plurality of metal pins installed at plural places along a circumferential direction of the contact plate and coming in contact with the plating surface of the substrate,   wherein the power source applies the voltage to the plating surface of the substrate through the metal pins.   
     
     
         5 . The apparatus of  claim 3 , wherein the substrate supporting member includes:
 a supporting plate;   a plurality of chuck pins installed at edges of the supporting plate so as to be upwardly protruded from the supporting plate; and   a chuck pin transferring unit moving the chuck pins between a supporting position which supports lateral parts of the substrate and a standby position farther away from a center of the supporting plate compared to the supporting position,   wherein the chuck pin transferring unit includes:   a plurality of movable roads disposed inside the supporting plate in a radial manner, the chuck pins being coupled to one end of a respective of each of the movable roads;   a vertical road provided inside a supporting shaft coupled to a lower part of the supporting plate so as to be movable in a vertical direction;   connection members, one end of the connection members being hinge-coupled to the other end of a respective one of each of the movable roads, and the other end of the connection members being hinge-coupled to an upper end of the vertical road; and   a second driving portion ascending and descending the vertical road.   
     
     
         6 . The apparatus of  claim 3 , further comprising: a plating solution agitation member provided below the anode electrode inside the plating bath and agitating the plating solution supplied onto the substrate from the plating solution discharge nozzle. 
     
     
         7 . The apparatus of  claim 6 , wherein the plating solution agitation member includes:
 an agitation plate disposed below the anode electrode, a plurality of through holes are formed in the agitation plate to pass the plating solution therethrough; and   a third driving portion for rotating the agitation plate around a self-center axis perpendicular to the agitation plate.   
     
     
         8 . The apparatus of  claim 7 , wherein a size of the through holes become smaller toward a periphery of the agitation plate from a center of the agitation plate. 
     
     
         9 . The apparatus of  claim 3 , further comprising:
 a bowl provided below the plating bath so as to surround the substrate supporting member of a descent position; and   a treatment fluid supply member provided outside the bowl,   wherein the treatment fluid supply member includes a de-ionized water supply member, a pre-treatment solution supply member, a chemical solution supply member and a dry gas supply member,   wherein the de-ionized water supply member supplies de-ionized water for rinsing the substrate before and after a plating process on the substrate, the pre-treatment solution supply member supplies non-additive plating solution for pre-treating the substrate after the rinsing process on the substrate, the chemical solution supply member supplies a chemical solution to clean the substrate after the plating process on the substrate and the dry gas supply member supplies dry gas to dry the substrate after the plating, the rinsing and the cleaning processes, and   wherein the bowl recovers at least one of the de-ionized water, the non-additive plating solution and the cleaning solution dispersed by rotation of the substrate.   
     
     
         10 . The apparatus of  claim 9 , further comprising:
 a drip bath provided between the plating bath and the bowl to receive the plating solution falling from the plating bath; and   a fourth driving portion moving the drip bath across inside and outside of a space between the plating bath and the bowl.   
     
     
         11 . The apparatus of  claim 9 , wherein the plating bath includes:
 an upper wall;   a first sidewall extending downwardly from an edge of the upper wall;   a second sidewall provided inside the first sidewall to surround the anode electrode and extending downwardly from the upper wall; and   a ring-shaped contact plate coupled to a lower end of the second sidewall and coming in contact with an edge of the substrate due to the ascent of the substrate supporting member,   wherein the second sidewall is formed with a plurality of overflow holes that cause the plating solution filled in a plating space formed by the second sidewall, the contact plate, and the substrate to overflow between the first sidewall and the second sidewall.   
     
     
         12 . The apparatus of  claim 11 , wherein the bowl includes:
 a first recovery vessel surrounding the substrate supporting member and having an opened upper part;   a second recovery vessel having vessel-shaped upper and lower parts and provided to be movable in a vertical direction along a sidewall of the first recovery vessel; and   a third recovery vessel coupled to the second recovery vessel to surround the second recovery vessel, an upper end of the third recovery vessel coming in contact with a lower end of the first sidewall of the plating bath by an ascent of the second recovery vessel, and   the plating solution, which is overflowed between the first and second sidewalls of the plating bath, is recovered into the third recovery vessel.   
     
     
         13 . The apparatus of  claim 12 , wherein the second recovery vessel includes:
 a ring-shaped outside vertical wall disposed outside the first recovery vessel;   a ring-shaped inside vertical wall disposed inside the first recovery vessel and surrounding the substrate supporting member; and   a ring-shaped coupling plate that is coupled to an upper end of the inside vertical wall and an upper end of the outside vertical wall, and   an opening area of the coupling plate is smaller than an area of the supporting plate of the substrate supporting member such that the second recovery vessel ascends and descends by the ascent and descent of the substrate supporting member, and the coupling plate comes in contact with the lower end of the second sidewall of the plating bath by the ascent of the second recovery vessel.   
     
     
         14 - 20 . (canceled)