Method for protecting encapsulated sensor structures using stack packaging

Abstract

A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, in which the micro-mechanical sensor structure is fabricated with a protective membrane, the micro-mechanical sensor chip is arranged so that a surface of the protective membrane faces toward a second chip, and the micro-mechanical sensor chip is secured to the second chip.

1 - 20 . (canceled) 
     
     
         21 . A micro-mechanical sensor device, comprising:
 a first chip; and   a micro-mechanical sensor chip having an embedded micro-mechanical sensor structure and a protective membrane arranged on a face of the embedded micro-mechanical sensor structure, wherein the micro-mechanical sensor chip is arranged directly onto a face of the first chip that faces and is parallel to the face of the embedded micro-mechanical sensor structure so that the protective membrane is arranged between the faces.   
     
     
         22 . The micro-mechanical sensor device of  claim 21 , wherein the protective membrane is configured at a reduced thickness. 
     
     
         23 . The micro-mechanical sensor device of  claim 21 , wherein a thickness of the protective membrane is less than 10 microns. 
     
     
         24 . The micro-mechanical sensor device of  claim 21 , further comprising:
 a bond to secure the micro-mechanical sensor chip to the first chip.   
     
     
         25 . The micro-mechanical sensor device of  claim 21 , further comprising:
 a sealing bond ring to surround the embedded micro-mechanical structure.   
     
     
         26 . The micro-mechanical sensor device of  claim 21 , wherein the protective membrane includes an opening. 
     
     
         27 . The micro-mechanical sensor device of  claim 21 , wherein the protective membrane is at least partially absent. 
     
     
         28 . The micro-mechanical sensor device of  claim 21 , wherein the embedded micro-mechanical sensor structure is sensitive to one of a pressure, acceleration, a rotation, and a temperature. 
     
     
         29 . The micro-mechanical sensor device of  claim 21 , wherein the first chip is at least one of an electronic integrated circuit chip and an actuator chip. 
     
     
         30 . A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, comprising:
 fabricating the micro-mechanical sensor structure with a protective membrane;   arranging the micro-mechanical sensor chip so that a surface of the protective membrane faces toward a second chip; and   securing the micro-mechanical sensor chip to the second chip.   
     
     
         31 . The method of  claim 30 , further comprising:
 configuring the protective membrane at a reduced thickness.   
     
     
         32 . The method of  claim 30 , wherein the protective membrane is configured using a chemical and mechanical planarization process. 
     
     
         33 . The method of  claim 30 , wherein a thickness of the protective membrane is less than 10 microns. 
     
     
         34 . The method of  claim 30 , further comprising:
 configuring a sealing bond ring to surround the micro-mechanical sensor structure.   
     
     
         35 . The method of  claim 30 , wherein the protective membrane includes an opening. 
     
     
         36 . The method of  claim 30 , wherein the protective membrane is configured to be at least partially absent. 
     
     
         37 . The method of  claim 30 , further comprising:
 arranging at least one additional micro-mechanical sensor chip at least one of on, underneath, and between the micro-mechanical sensor chip and the second chip to provide a multi-sensor device.   
     
     
         38 . The method of  claim 30 , further comprising:
 applying a bond between the micro-mechanical sensor chip and the second chip to secure the micro-mechanical sensor chip to the second chip;   arranging the micro-mechanical sensor chip and the second chip on a package frame to support the micro-mechanical sensor chip and the second chip in a single package; and   applying a plastic mold to seal the micro-mechanical sensor chip and the second chip in the single package.   
     
     
         39 . The method of  claim 30 , further comprising:
 configuring a sealing bond ring to surround the micro-mechanical sensor structure;   arranging the micro-mechanical sensor chip and the second chip on a package frame to support the micro-mechanical sensor chip and the second chip in a single package; and   applying a plastic mold to seal the micro-mechanical sensor chip and the second chip in the single package.   
     
     
         40 . A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, comprising:
 fabricating the micro-mechanical sensor structure with a sealing bond to surround the micro-mechanical sensor structure;   arranging the micro-mechanical sensor chip so that a surface of the protective membrane faces toward a second chip; and   securing the micro-mechanical sensor chip to the second chip.