Liquid cooling device

Abstract

A liquid cooling device includes a heat-dissipating member, a driving member and a heat-absorbing member connected together to form a heat transfer loop. A coolant is filled in the heat transfer loop. The heat-absorbing member defines therein a receiving chamber. A heat sink and a heat pipe are received in the receiving chamber. The heat pipe thermally connects the heat sink to a heat-absorbing plate of the heat-absorbing member. The heat-absorbing plate is used for contacting with a heat-generating component. The coolant is driven by the driving member to circulate between the heat-absorbing member. Heat generated by the heat-generating component is absorbed by the heat-absorbing plate and transferred to the heat sink via the heat pipe. The heat sink releases the heat to the coolant. The coolant takes the heat from the heat-absorbing member to the heat-dissipating member for dissipating.

1 . A liquid cooling device, comprising:
 a heat-dissipating member;   a driving member; and   a heat-absorbing member defining therein a receiving chamber, a heat sink and a heat pipe being received in the receiving chamber, the heat pipe thermally connecting the heat sink to a heat-absorbing plate of the heat-absorbing member, the heat-absorbing plate being adapted for contacting with a heat-generating component, the heat-absorbing member, the heat-dissipating member and the driving member being connected together to form a heat transfer loop, a coolant being filled in the heat transfer loop, the coolant being driven by the driving member to circulate through the heat-absorbing member and the heat-dissipating member, whereby heat generated by the heat-generating component is absorbed by the heat-absorbing plate and transferred to the heat sink via the heat pipe, the heat sink releases the heat to the coolant, and the coolant takes the heat from the heat-absorbing member to the heat-dissipating member for dissipating.   
     
     
         2 . The liquid cooling device of  claim 1 , wherein the heat sink comprises a plurality of fins stacked together, the heat pipe comprises an evaporating section and a condensing section, the evaporating section is fixed to the heat-absorbing plate of the heat-absorbing member, and the condensing section is fixed to the heat sink. 
     
     
         3 . The liquid cooling device of  claim 2 , wherein a through hole is defined in the heat sink and the condensing section of the heat pipe is fixed in the through hole of the heat sink. 
     
     
         4 . The liquid cooling device of  claim 2 , wherein the heat pipe is U-shaped, the evaporating section is formed at a central portion of the heat pipe, the condensing section is formed at each of two opposite ends of the evaporating section. 
     
     
         5 . The liquid cooling device of  claim 1 , wherein the heat-absorbing member further comprises a cover hermetically connected to the heat-absorbing plate, the receiving chamber is defined between the cover and the heat-absorbing plate. 
     
     
         6 . The liquid cooling device of  claim 5 , wherein the cover comprises a sealing plate and a sidewall extending from an outer periphery of the sealing plate, an inlet hole and an outlet hole are defined through the sidewall. 
     
     
         7 . The liquid cooling device of  claim 5 , wherein a waterproof ring is arranged between the heat-absorbing plate and the cover. 
     
     
         8 . The liquid cooling device of  claim 7 , wherein an annular groove is defined between the heat-absorbing plate and the cover, and the waterproof ring is fixed in the groove. 
     
     
         9 . The liquid cooling device of  claim 1 , wherein the heat-absorbing plate is made of copper. 
     
     
         10 . The liquid cooling device of  claim 1 , wherein the heat-absorbing plate is made of a material of good heat conductivity. 
     
     
         11 . The liquid cooling device of  claim 1 , wherein the heat sink and the heat pipe is immersed in the coolant contained in the receiving chamber.