Cooling arrangement

Abstract

The invention relates to an arrangement for cooling at least one electrical and/or electronic component and/or group of electrical/electronic components by means of a cooling body. The cooling body demonstrates at least one recess into which the electrical/electronic component and/or the group of electrical/electronic components to be cooled can be inserted. Introduced into the recess of the cooling body is a medium, which nearly completely surrounds the at least one electrical/electronic component and/or the group of electrical/electronic components in their state of insertion into the recess.

1 - 7 . (canceled) 
     
     
         8 . An arrangement for cooling at least one electronic component by means of a cooling body characterized in that the cooling body demonstrates at least one recess into which the electronic component to be cooled can be inserted and that a medium, which nearly completely surrounds the at least one electronic component in their state of insertion into the recess, is introduced into the recess. 
     
     
         9 . Arrangement according to claim  1 , characterized in that the medium is a heat transfer medium, that the heat transfer medium is liquid, viscous, gelatinous, colloidal or adhesive-like, and that the heat transfer medium has good thermal conductivity. 
     
     
         10 . Arrangement according to claim  1 , characterized in that the at least one electronic component to be cooled is connected at least electrically to a printed circuit board and arranged offset from the printed circuit board or fixed on the printed circuit board. 
     
     
         11 . The arrangement according to  claim 10 , characterized in that the at least one electronic component to be cooled can be inserted into the recess of the cooling body in common with the printed circuit board. 
     
     
         12 . Arrangement according to  claim 11 , characterized in that the printed circuit board is adapted to be fastened on the cooling body such that an air gap remains between the printed circuit board and the cooling body. 
     
     
         13 . Arrangement according to claim  1 , characterized in that the at least one electronic component is surrounded by a frame, wherein the frame prevents the at least one electronic component from forming a short circuit by coming into contact with the cooling body when the at least one electronic component is inserted into the recess of the cooling body and in the state of insertion of the at least one electronic component into the recess. 
     
     
         14 . Arrangement according to  claim 13 , characterized in that the at least one electronic component to be cooled is connected at least electrically to a printed circuit board and arranged offset from the printed circuit board or fixed on the printed circuit board. 
     
     
         15 . Arrangement according to  claim 14 , characterized in that the printed circuit board is adapted to be fastened on the cooling body such that an air gap remains between the printed circuit board and the cooling body. 
     
     
         16 . Arrangement according to  claim 14 , characterized in that the frame consists of non-conducting material, the frame surrounds the at least one electronic component to be cooled on at least two edges, the frame is connected to the printed circuit board and supports the at least one electronic component to be cooled. 
     
     
         17 . The arrangement according to  claim 16 , characterized in that the frame demonstrates an opening into which the at least one electronic component to be cooled can be inserted into the frame, and that the inside of the frame demonstrates guiding mechanisms that guide the at least one electronic component to be cooled during the insertion into the frame. 
     
     
         18 . The arrangement according to  claim 17 , characterized in that the opening is on a side of the frame facing away from the printed circuit board. 
     
     
         19 . The arrangement according to  claim 17 , characterized in that the opening is on a side of the frame facing toward the printed circuit board. 
     
     
         20 . Arrangement according to  claim 17 , characterized in that the printed circuit board is adapted to be fastened on the cooling body such that an air gap remains between the printed circuit board and the cooling body. 
     
     
         21 . The arrangement according to  claim 18 , characterized in that the at least one electronic component to be cooled can be inserted into the recess of the cooling body in common with the printed circuit board.