Carrier and adhesion amount measuring apparatus, and measuring method, program, and recording medium of the same

Abstract

The present invention measures a quantity of attachment (such as density) of a material (such as catalyst and promoter) attached to a carrier. A carrier 1 includes attachment holes 12 to which a catalyst 24 attaches, and non-attachment holes 14 to which the catalyst 24 does not attach, where extension directions of the attachment holes 12 and the non-attachment holes 14 are parallel with each other (perpendicular to a first end surface 1 a ), and are opened on the first end surface 1 a and a second end surface 1 b. An attachment quantity measurement device includes an electromagnetic wave output device 2 that outputs a terahertz wave at a frequency equal to or more than 0.01 [THz] and equal to or less than 100 [THz] toward the carrier 1, an electromagnetic wave detector 4 that detects the terahertz wave which has transmitted through the carrier 1, a reference value deriving unit 7 that derives, based on a result detected by the electromagnetic wave detector 4, any one of an absorption rate, a group delay, and a dispersion of the terahertz wave in the non-attachment holes 14, and an attachment quantity deriving unit 8 that derives, based on the result detected by the electromagnetic wave detector 4 and the result derived by the reference value deriving unit 7, a weight or a density of the catalyst 24 present in the attachment holes 12.

1 . A carrier comprising:
 an attachment hole to which a predetermined component attaches; and   a non-attachment hole to which the predetermined component does not attach.   
     
     
         2 . The carrier according to  claim 1 , wherein the direction of an extension of the attachment hole and the direction of an extension of the non-attachment hole are parallel with each other. 
     
     
         3 . The carrier according to  claim 1 , comprising two end surfaces that are parallel with each other, wherein the attachment hole and the non-attachment hole open on the two end surfaces. 
     
     
         4 . A method of manufacturing the carrier according to  claim 1 ,
 wherein the carrier includes a plurality of holes having a first opening portion and a second opening portion on an opposite side with respect to the first opening portion,   the method of manufacturing the carrier comprising:   closing the first opening portion and the second opening portion of a part of the plurality of holes; and   immersing the carrier in a liquid in which the predetermined component is present.   
     
     
         5 . A method of manufacturing the carrier according to  claim 1 ,
 wherein the carrier includes   a plurality of holes having a first opening portion and a second opening portion on an opposite side with respect to the first opening portion, and   a first end surface on which the first opening portion opens,   the method of manufacturing the carrier comprising:   closing the first opening portion of a part of the plurality of holes; and   splaying, toward the first end surface, a liquid in which the predetermined component is present.   
     
     
         6 . A method of manufacturing the carrier according to  claim 1 ,
 wherein the carrier includes   a plurality of holes having a first opening portion and a second opening portion on an opposite side with respect to the first opening portion,   a first end surface on which the first opening portion opens, and   a second end surface on which the second opening portion opens, the method of manufacturing the carrier comprising:   closing the second opening portion of a part of the plurality of holes; and   immersing the carrier in a liquid in which the predetermined component is present such that the liquid surface of the liquid is higher than the second end surface and lower than the first end surface.   
     
     
         7 . A method of manufacturing the carrier according to  claim 1 ,
 wherein the carrier includes   a plurality of holes having a first opening portion and a second opening portion on an opposite side with respect to the first opening portion, and   a first end surface on which the first opening portion opens,   the method of manufacturing the carrier comprising:   immersing the carrier in a liquid in which the predetermined component is present such that the liquid surface of the liquid is lower than the first opening portion of a part of the plurality of holes.   
     
     
         8 . An attachment quantity measurement device comprising:
 an electromagnetic wave output device that outputs an electromagnetic wave to be measured having a frequency equal to or higher than 0.01 [THz] and equal to or lower than 100 [THzI toward the carrier according to  claim 1 ;   an electromagnetic wave detector that detects the electromagnetic wave to be measured which has transmitted through the carrier;   a reference value deriving unit that derives, based on a result detected by the electromagnetic wave detector, any one of an absorption rate, a group delay, and a dispersion of the electromagnetic wave to be measured in the non-attachment hole; and   an attachment quantity deriving unit that derives, based on the result detected by the electromagnetic wave detector and the result derived by the reference value deriving unit, a weight or a density of the predetermined component present in the attachment hole.   
     
     
         9 . The attachment quantity measurement device according to  claim 8 , comprising:
 a rotational drive unit that rotates the carrier or a travel direction of the electromagnetic wave to be measured while a line in a direction perpendicular to the travel direction of the electromagnetic wave to be measured is set as a rotational axis; and   a linear drive unit that moves the carrier or the travel direction of the electromagnetic wave to be measured in a direction perpendicular to the travel direction of the electromagnetic wave to be measured and the rotational axis,   wherein the detection is carried out by the electromagnetic wave detector while the rotational drive unit and the linear drive unit are operating.   
     
     
         10 . An attachment quantity measurement method using an attachment quantity measurement device including: an electromagnetic wave output device that outputs an electromagnetic wave to be measured having a frequency equal to or higher than 0.01 [THz] and equal to or lower than 100 [THz] toward the carrier according to  claim 1 ; and an electromagnetic wave detector that detects the electromagnetic wave to be measured which has transmitted through the carrier; said attachment quantity measurement method comprising:
 deriving a reference value, based on a result detected by the electromagnetic wave detector, any one of an absorption rate, a group delay, and a dispersion of the electromagnetic wave to be measured in the non-attachment hole; and   deriving an attachment quantity, based on the result detected by the electromagnetic wave detector and the result derived by the reference value deriving step, a weight or a density of the predetermined component present in the attachment hole.   
     
     
         11 . A program of instructions for execution by a computer to perform an attachment quantity measurement process using an attachment quantity measurement device including: an electromagnetic wave output device that outputs an electromagnetic wave to be measured having a frequency equal to or higher than 0.01 [THz] and equal to or lower than 100 [THz] toward the carrier according to  claim 1 ; and an electromagnetic wave detector that detects the electromagnetic wave to be measured which has transmitted through the carrier; said attachment quantity measurement process comprising:
 deriving a reference value, based on a result detected by the electromagnetic wave detector, any one of an absorption rate, a group delay, and a dispersion of the electromagnetic wave to be measured in the non-attachment hole; and   deriving an attachment quantity, based on the result detected by the electromagnetic wave detector and the result derived by the deriving of the reference value, a weight or a density of the predetermined component present in the attachment hole.   
     
     
         12 . A computer-readable medium having a program of instructions for execution by a computer to perform an attachment quantity measurement process using an attachment quantity measurement device including an electromagnetic wave output device that outputs an electromagnetic wave to be measured having a frequency equal to or higher than 0.01 [THz] and equal to or lower than 100 [THz] toward the carrier according to  claim 1 ; and an electromagnetic wave detector that detects the electromagnetic wave to be measured which has transmitted through the carrier; said attachment quantity measurement process comprising:
 deriving a reference value, based on a result detected by the electromagnetic wave detector, any one of an absorption rate, a group delay, and a dispersion of the electromagnetic wave to be measured in the non-attachment hole; and   deriving an attachment quantity, based on the result detected by the electromagnetic wave detector and the result derived by the deriving of the reference value, a weight or a density of the predetermined component present in the attachment hole.