Method for fabricating highly conductive fine patterns using self-patterned conductors and plating

Abstract

Provided is a method for forming a highly conductive micropattern, including: depositing a polymer material on a substrate; removing a portion of the polymer material to form a mask template having a dent through which a portion of the substrate is exposed to the exterior; depositing conductive ink to the top of the mask; heat treating the conductive ink in order to extract metal nanoclusters from a metallic compound dissolved in the conductive ink, wherein the portion coated with the polymer material is allowed to form an insulating pattern having electrically insulating property, while the conductive ink in the dent forms a conductive pattern having electroconductive property by the fusion of the metal nanoclusters extracted from the conductive ink; and plating a metallic material on the conductive pattern.

1 . A method for forming a highly conductive micropattern includes:
 depositing a polymer material on a substrate;   removing a portion of the polymer material to form a mask template having a dent through which a portion of the substrate is exposed to the exterior;   depositing conductive ink to the top of the mask template;   heat treating the conductive ink in order to extract metal nanoclusters from a metallic compound dissolved in the conductive ink, wherein the portion coated with the polymer material is allowed to form an insulating pattern having electrically insulating property, while the conductive ink in the dent forms a conductive pattern having electroconductive property by the fusion of the metal nanoclusters extracted from the conductive ink; and   plating a metallic material on the conductive pattern.   
     
     
         2 . The method for forming a highly conductive micropattern according to  claim 1 , which further comprises removing the insulating pattern deposited on the substrate, after said plating. 
     
     
         3 . The method for forming a highly conductive micropattern according to  claim 1 , wherein said plating is carried out by electroplating based on electrochemical reactions or light induced plating based on photoelectrochemical reactions. 
     
     
         4 . The method for forming a highly conductive micropattern according to  claim 1 , wherein the metallic material is any one selected from silver, copper and nickel. 
     
     
         5 . The method for forming a highly conductive micropattern according to  claim 1 , wherein the substrate is a silicon wafer and is used for fabricating solar cells. 
     
     
         6 . The method for forming a highly conductive micropattern according to  claim 1 , wherein when carrying out the heat treatment, the conductive ink deposited on the polymer material infiltrates into the interstitial spaces of the polymer material and the metal nanoclusters extracted from the conductive ink by the heat treatment are disposed in the polymer material while being spaced apart from each other, so that the insulating pattern has electrically insulating property as a whole. 
     
     
         7 . The method for forming a highly conductive micropattern according to  claim 1 , wherein the conductive ink is deposited on the mask template by an inkjet printing process. 
     
     
         8 . The method for forming a highly conductive micropattern according to  claim 1 , wherein when forming the mask template, laser beams are irradiated to the polymer material to remove the polymer material. 
     
     
         9 . The method for forming a highly conductive micropattern according to  claim 1 , wherein when forming the mask template, the polymer material is subjected to imprinting by pressurizing and heating it with a stamp so as to remove the polymer material. 
     
     
         10 . The method for forming a highly conductive micropattern according to  claim 1 , wherein the heat treatment is carried out by heating the conductive ink and the polymer material at a temperature between 150° C. and 350° C. 
     
     
         11 . The method for forming a highly conductive micropattern according to  claim 1 , wherein the polymer material is polyaniline. 
     
     
         12 . The method for forming a highly conductive micropattern according to  claim 1 , wherein the conductive ink is an organometallic compound in a solution state. 
     
     
         13 . The method for forming a highly conductive micropattern according to  claim 12 , wherein the conductive ink further comprises metal nanoclusters.