Apparatus and systems for processing signals between a tester and a plurality of devices under test

Abstract

Apparatus is for processing signals between a tester and devices under test. In one embodiment, the apparatus includes at least one multichip module. Each multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to devices under test. At least one driver is provided to operate each of the micro-electromechanical switches. Other embodiments are also disclosed.

1 . Apparatus for processing signals between a tester and a plurality of devices under test, the apparatus comprising:
 at least one multichip module, each of the at least one multichip module comprising:
 a plurality of micro-electromechanical switches between a first set of connectors to the tester and a second set of connectors to the plurality of devices under test; and 
 at least one driver to selectively operate each of the plurality of micro-electromechanical switches. 
   
     
     
         2 . Apparatus in accordance with  claim 1 , further comprising a probe card on which each one of the at least one multichip module is directly mounted. 
     
     
         3 . Apparatus in accordance with  claim 1 , further comprising a plurality of MEMs dice on which the plurality of micro-electromechanical switches are formed. 
     
     
         4 . Apparatus in accordance with  claim 1 , wherein the separate MEMs dice each include eight single pole triple throw switches. 
     
     
         5 . Apparatus in accordance with  claim 1 , further comprising an attachment component for each one of the at least one multichip module, and wherein the attachment component mounts the multichip module to a probe card. 
     
     
         6 . Apparatus in accordance with  claim 5 , wherein the attachment component includes passageways through the multichip module for a set of screws to mount the multchip module to the probe card. 
     
     
         7 . Apparatus in accordance with  claim 1 , wherein the driver is designed to supply an electrostatic potential to activate a MEMs gate associated with each of the plurality of micro-electromechanical switches. 
     
     
         8 . Apparatus in accordance with  claim 1 , wherein the at least one driver comprises a vacuum-florescent display driver dice. 
     
     
         9 . A system for processing signals between a tester and a plurality of devices under test, the system comprising:
 at least one multichip module mounted directly on a probe card and operable at a temperature of at least 125° C., and each of the at least one multichip module having a plurality of micro-electromechanical switches between a first set of connectors to the tester and a second set of connectors to the plurality of devices under test.   
     
     
         10 . A system in accordance with  claim 9 , wherein the second set of connectors attach to a probe array having at least 6000 probe tip needles so as to test at least 6000 test sites of the plurality of devices under test during a single touchdown of the probe array. 
     
     
         11 . A system for testing a plurality of devices under test, the system comprising:
 a set of tester electronics to generate signals for application to the plurality of devices under test, and to receive signals generated by the plurality of devices under test;   a probe card with at least one multichip module mounted thereon, each of the at least one multichip module comprising a plurality of micro-electromechanical switches between a first set of connectors to the set of tester electronics and a second set of connectors to the plurality of devices under test, and a driver to selectively operate each of the plurality of micro-electromechanical switches; and   a probe array to transmit signals between the at least one multichip module of the probe card and the plurality of devices under test.   
     
     
         12 . A system in accordance with  claim 11 , wherein each of the at least one multichip modules has a plurality of MEMS dice thereon. 
     
     
         13 . A system in accordance with  claim 11 , wherein each one of the plurality of MEMS dice each contain a plurality of micro-electromechanical switches. 
     
     
         14 . A system in accordance with  claim 13 , wherein the switches are single pole triple throw switches. 
     
     
         15 . A system in accordance with  claim 13 , wherein the switches are single pole double throw switches. 
     
     
         16 . A system in accordance with  claim 11 , wherein the probe card has a maximum diameter of 440 millimeters. 
     
     
         17 . A system in accordance with  claim 16 , wherein the probe card forms an opening for the probe array, and the opening has a minimum diameter of 330 millimeters. 
     
     
         18 . A system in accordance with  claim 11 , wherein the probe array has at least 6000 probe tip needles so as to test at least 6000 test sites of the plurality of devices under test during a single touchdown of the probe array.