Metal pattern forming method, metal pattern obtained by the same, printed wiring board, conductive film forming method, and conductive film obtained by the same

Abstract

The present invention provides a metal pattern formed on a substrate. The metal pattern is constructed in (I) forming on a substrate a polymer layer in which a polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof is chemically bonded directly to the substrate in a pattern form, (II) adding the electroless plating catalyst or precursor thereof to the polymer layer, and (III) forming a metal layer in the pattern form by electroless plating.

1 . A metal pattern having a metal layer locally formed on a substrate, wherein the metal layer is a metal layer formed on the substrate by forming a polymer layer in which a polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof is chemically bonded in a pattern form directly on the substrate, adding the electroless plating catalyst or precursor thereof to the polymer layer, and carrying out electroless plating on the polymer layer, and the polymer layer a region having dispersed therein fine particles comprising at least one of electroless plating catalyst particles and metal particles deposited by the electroless plating, in a content of 25% by volume or more, and the region extending 0.05 μm or more from the interface of the polymer layer and the metal layer in a direction toward the substrate. 
     
     
         2 . The metal pattern according to  claim 1  having the metal layer locally formed on the substrate having a surface roughness of 500 nm or less, wherein the adhesiveness between the substrate and the metal layer is 0.2 kN/m or more. 
     
     
         3 . The metal pattern according to  claim 2 , wherein the substrate is a substrate having a surface roughness of 100 nm or less. 
     
     
         4 . The metal pattern according to  claim 1 , wherein the substrate is a substrate comprising a insulating resin having a dielectric loss tangent of 0.01 or less at 1 GHz. 
     
     
         5 . The metal pattern according to  claim 1 , wherein the substrate is a substrate consisting of a insulating resin having a dielectric constant of 3.0 or less at 1 GHz. 
     
     
         6 . A printed wiring board, wherein the metal pattern according to  claim 4  is used as a conductive layer. 
     
     
         7 . A conductive film formed on a substrate having a surface roughness of 500 nm or more, wherein the substrate comprises a polymerization initiating layer in which a polymer having, on a side chain thereof, a crosslinking group and a functional group having polymerization initiating capability is immobilized by a crosslinking reaction on a base material, wherein the conductive film is formed on the substrate by forming on the polymerization initiating layer a polymer layer in which a polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof is chemically bonded directly on the particular polymerization initiating layer, adding the electroless plating catalyst or precursor thereof to the polymer layer, and carrying out electroless plating on the polymer layer, and wherein the polymer layer has a region having dispersed therein fine particles comprising at least one of electroless plating catalyst particles and metal particles deposited by the electroless plating, in a content of 25% by volume or more, and the region extending 0.05 μm or more from the interface of the polymer layer and the metal layer in a direction toward the substrate. 
     
     
         8 . A printed wiring board, wherein the metal pattern according to  claim 5  is used as a conductive layer.