Method for manufacturing inkjet head

Abstract

A method for manufacturing an inkjet head is disclosed. The method for manufacturing an inkjet head can include preparing a head body including a vibrating membrane, which is located in an upper portion of the head body, coating a lower electrode over the vibrating membrane, patterning a resist such that an open area is formed over the vibrating membrane, filling a piezoelectric material in the open area, selectively coating an upper electrode over the piezoelectric material, and removing the resist.

1 . A method for manufacturing an inkjet head, the method comprising:
 preparing a head body including a vibrating membrane, the vibrating membrane located in an upper portion of the head body;   coating a lower electrode over the vibrating membrane;   patterning a resist such that an open area is formed on an upper side of the vibrating membrane;   filling a piezoelectric material in the open area;   selectively coating an upper electrode over the piezoelectric material; and   removing the resist.   
     
     
         2 . The method of  claim 1 , wherein the resist is made of a material including polysilicon, and the removing of the resist is carried out by an etching process using XeF 2  gas. 
     
     
         3 . The method of  claim 1 , further comprising forming an inlet port in the head body, after the removing of the resist. 
     
     
         4 . The method of  claim 1 , wherein the filling of a piezoelectric material comprises:
 depositing the piezoelectric material in the open area and over the resist; and   removing a portion of the deposited piezoelectric material such that an upper surface of the resist is exposed.   
     
     
         5 . The method of  claim 1 , wherein the resist is a photo-resist, and the selectively coating of an upper electrode comprises:
 coating a conductive layer over the piezoelectric material and over the photo-resist; and   patterning the upper electrode over the piezoelectric material by removing a portion of the conductive layer coated over the photo-resist by etching the photo-resist.