Heat radiating component

Abstract

A heat radiating component provided on a semiconductor package, the heat radiating component coming in contact with a semiconductor element, the heat radiating component includes a heat radiating plate having a concave part; linear high thermal conductivity materials formed on a bottom surface of the concave part so as to stand in a thermal conductive direction; first and second resin layers configured to fill space parts formed by the neighboring linear high thermal conductivity materials, the first and the second resin layers being stacked on the bottom surface of the concave part in order to expose head end parts of the linear high thermal conductivity materials; and a metal layer formed on an upper surface of the second resin layer and at least a portion of a surface of the heat radiating plate where the concave part is formed.

1 . A heat radiating component provided on a semiconductor package, the heat radiating component coming in contact with a semiconductor element, the heat radiating component comprising:
 a heat radiating plate having a concave part;   linear high thermal conductivity materials formed on a bottom surface of the concave part so as to stand in a thermal conductive direction;   first and second resin layers configured to fill space parts formed by the neighboring linear high thermal conductivity materials, the first and the second resin layers being stacked on the bottom surface of the concave part in order to expose head end parts of the linear high thermal conductivity materials; and   a metal layer formed on an upper surface of the second resin layer and at least a portion of a surface of the heat radiating plate where the concave part is formed so as to cover the head end parts of the linear high thermal conductivity materials;   wherein a surface opposite to a surface of the metal layer coming in contact with the upper surface of the second resin layer comes in contact with the semiconductor element;   a softening point of the first resin layer is equal to or higher than a maximum temperature of a heat generation range of the semiconductor element; and   a softening point of the second resin layer is equal to or less than a minimum temperature of the heat generation range of the semiconductor element.   
     
     
         2 . The heat radiating component as claimed in  claim 1 ,
 wherein a material of the second resin layer is hot melt resin.   
     
     
         3 . The heat radiating component as claimed in  claim 1 ,
 wherein the linear high thermal conductivity materials are carbon nanotubes.   
     
     
         4 . The heat radiating component as claimed in  claim 1 ,
 wherein a thickness of the metal layer is greater than a length between a position of a head end part of a shortest linear high thermal conductivity material among the linear high thermal conductivity materials and a position of a head end part of a longest linear high thermal conductivity material among the linear high thermal conductivity materials.   
     
     
         5 . The heat radiating component as claimed in  claim 1 ,
 wherein the heat radiating plate is made of a material whose main ingredient is oxygen free copper.