US2011083712A1PendingUtilityA1

Thermoelectric Module

Assignee: HA GOOK HYUNPriority: Apr 17, 2007Filed: Apr 10, 2008Published: Apr 14, 2011
Est. expiryApr 17, 2027(~0.7 yrs left)· nominal 20-yr term from priority
H10N 10/17H10N 10/01
41
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Claims

Abstract

Provided is a thermoelectric module including electrodes and P-type and N-type semiconductors formed on a substrate by a printing method. The thermoelectric module includes upper and lower substrates ( 110 and 120 ) formed of ceramic or aluminum and forming upper and lower surfaces of the thermoelectric module; electrodes ( 130 ) disposed on surfaces of the upper and lower substrates ( 110 and 120 ), the electrodes being formed of an electrically conductive material for transmitting electric power; a plurality of P-type and N-type semiconductors ( 140 and 150 ) spaced between the electrodes ( 130 ), the P-type and N-type semiconductors ( 140 and 150 ) being forming by sintering a paste mixture of thermoelectric powder and an organic solvent, wherein the electrodes ( 130 ) and the P-type and N-type semiconductors ( 140 and 150 ) are formed by a printing method. With this configuration, thin thermoelectric module having various sizes and shapes can be provided.

Claims

exact text as granted — not AI-modified
1 . A thermoelectric module comprising:
 upper and lower substrates formed of ceramic or aluminum and forming upper and lower surfaces of the thermoelectric module;   electrodes disposed on surfaces of the upper and lower substrates, the electrodes being formed of an electrically conductive material for transmitting electric power;   a plurality of P-type and N-type semiconductors spaced between the electrodes, the P-type and N-type semiconductors being forming by sintering a paste mixture of thermoelectric powder and an organic solvent,   wherein the electrodes and the P-type and N-type semiconductors are formed by a printing method.   
     
     
         2 . The thermoelectric module according to  claim 1 , wherein the electrodes are formed by sintering a paste mixture of silver (Ag) or copper (Cu) powder and an organic solvent. 
     
     
         3 . The thermoelectric module according to  claim 1  or  2 , wherein the paste mixture comprises about 40% to about 95% by volume of the thermoelectric power. 
     
     
         4 . The thermoelectric module according to  claim 3 , wherein the organic solvent mixed with the thermoelectric powder is removed at a temperature equal to or lower than a sintering temperature of the thermoelectric powder. 
     
     
         5 . The thermoelectric module according to  claim 1 , wherein the printing method is a screen printing method.

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