Low-lead copper alloy

Abstract

The present invention provides a low-lead copper alloy, comprising 0.05 to 0.3 wt % of lead (Pb), 0.3 to 0.8 wt % of aluminum (Al), 0.01 to 0.4 wt % of bismuth (Bi), 0.1 to 2 wt % of nickel (Ni), and more than 96.5 wt % of copper (Cu) and zinc (Zn), wherein copper is in an amount ranging from 58 to 70 wt %. The low-lead copper alloy of the present invention has excellent material properties as well as good toughness and processability, thereby increasing the alloy strength and corrosion resistance thereof.

1 . A low-lead copper alloy, comprising:
 0.05 to 0.3 wt % of lead;   0.3 to 0.8 wt % of aluminum;   0.01 to 4 wt % of bismuth;   0.1 to 2 wt % of nickel; and   more than 96.5% of copper and zinc, wherein the copper is in an amount ranging from 58 to 70 wt %.   
     
     
         2 . The low-lead copper alloy of  claim 1 , wherein the copper is in an amount ranging from 62 to 65 wt %. 
     
     
         3 . The low-lead copper alloy of  claim 1 , wherein the lead is in an amount ranging from 0.15 to 0.25 wt %. 
     
     
         4 . The low-lead copper alloy of  claim 1 , wherein the aluminum is in an amount ranging from 0.5 to 0.65 wt %. 
     
     
         5 . The low-lead copper alloy of  claim 1 , wherein the bismuth is in an amount ranging from 0.1 to 0.2 wt %. 
     
     
         6 . The low-lead copper alloy of  claim 1 , wherein the nickel is in an amount ranging from 0.5 to 1 wt %.