US2011081152A1PendingUtilityA1
High-Speed Receiver Architecture
Est. expiryOct 3, 2025(expired)· nominal 20-yr term from priority
Inventors:Oscar E. AgazziDiego Ernesto CrivelliHugo Santiago CarrerMario Rafael HuedaGerman Cesar Augusto LunaCarl Grace
H04L 25/03184H03M 1/1215H04B 10/6971H03M 1/0626H04L 2025/03426H04L 2025/03477H03M 1/1004H04L 25/03292H04L 1/0054H03M 1/44H04L 1/06H04L 2025/03356H04L 25/03038H04L 25/025H04L 2025/03617H04L 25/0204H04L 1/0071H04L 25/03057
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Claims
Abstract
A receiver (e.g., for a 10G fiber communications link) includes an interleaved ADC coupled to a multi-channel equalizer that can provide different equalization for different ADC channels within the interleaved ADC. That is, the multi-channel equalizer can compensate for channel-dependent impairments. In one approach, the multi-channel equalizer is a feedforward equalizer (FFE) coupled to a Viterbi decoder, for example a sliding block Viterbi decoder (SBVD); and the FFE and/or the channel estimator for the Viterbi decoder are adapted using the LMS algorithm.
Claims
exact text as granted — not AI-modified1 . A transceiver chip for communication at a data rate of 10 Gbps or higher over a fiber optic, the transceiver chip comprising: a host interface for receiving digital data in electrical form at a data rate of 10 Gbps or higher, the received digital data in a host format; a laser driver port for generating an electrical signal modulated by the received data in electrical form, the electrical signal suitable for driving a laser driver; transmit path circuitry coupled between the host interface and the laser driver port; a TIA port for receiving an electrical signal from a transimpedance amplifier, the electrical signal modulated by data at a data rate of 10 Gbps or higher; and receive path circuitry coupled between the TIA port and the host interface, the host interface further for transmitting digital data in electrical form at a data rate of 10 Gbps or higher, the transmitted digital data also in the host format.
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