Reader/writer and manufacturing method thereof

Abstract

A reader/writer comprises a circuit board, a communication control portion mounted on the circuit board and configured to perform communication with IC tags, sealing resin for sealing the communication control portion; and an antenna electrically connected to the communication control portion, in which a resin layer is disposed on the sealing resin, the resin layer having a higher adhesiveness to a conductive film used as the antenna than that of the sealing resin, and the antenna is disposed on the resin layer.

1 . A reader/writer comprising:
 a circuit board;   a communication control portion mounted on the circuit board and configured to perform communication with IC tags;   sealing resin for sealing the communication control portion; and   an antenna electrically connected to the communication control portion by an electrode formed within a via, wherein a resin layer is disposed on the sealing resin, the resin layer having a higher adhesiveness to a conductive film used as the antenna than that of the sealing resin, and the antenna is disposed on the resin layer, wherein the via penetrates the resin layer and an internal wall of the via is covered with the resin layer.   
     
     
         2 . The reader/writer according to  claim 1 , wherein the resin layer includes resin containing soft magnetic metallic powder. 
     
     
         3 . The reader/writer according to  claim 2 , wherein the soft magnetic metallic powder is mixed with the resin as much as 10 wt % to 70 wt % relative to the resin. 
     
     
         4 . The reader/writer according to  claim 2 , wherein the soft magnetic metallic powder includes at least one selected from a group consisting of Al, Cr, Mn, Fe, Co, Ni, B, Si, Sr, Nb, Mo, Mg, Zn, and Pt. 
     
     
         5 . The reader/writer according to  claim 2 , wherein an average particle size of the soft magnetic metallic powder is 1 μm to 8 μm. 
     
     
         6 . A method for manufacturing a reader/writer including a communication control portion for communicating with IC tags, sealing resin for sealing the communication control portion, and an antenna electrically connected by an electrode formed within a via to the communication control portion mounted on a circuit board, the method comprising the steps of:
 mounting the communication control portion on the circuit board;   forming the sealing resin;   forming a resin layer on the sealing resin, the resin layer having a higher adhesiveness to a conductive film used as the antenna than that of the sealing resin; and   forming the antenna on the resin layer, wherein the via penetrates the resin layer and an internal wall of the via is covered with the resin layer.   
     
     
         7 . The reader/writer according to  claim 1 , wherein the via extends into a depth of the sealing resin and is covered by the resin layer in the depth of the sealing resin. 
     
     
         8 . The method for manufacturing a reader/writer according to  claim 6 , wherein the via extends into a depth of the sealing resin and is covered by the resin layer in the depth of the sealing resin.