Thermal Wick Cooling For Vibroacoustic Transducers
Abstract
A soft thermally-conductive wick is provided to be connected between the metallic components on a transducer and onto a thermal sink. Beryllia ceramic is provided to improve heat flux within the transducer while maintaining electrical insulation. The wick provides adequate heat flux and such that the mass and stiffness of the wick do not adversely affect the vibroacoustic properties of the transducer in the frequency band of interest. The mass of the wick attachment is considered in the transducer design with the location and direction of the wick attachment designed so as to not introduce rocking modes or other adverse affects in the frequency band of interest. The wick may be strung, coiled, folded or configured in many ways between the transducer and the thermal sink to ensure that no acoustic or vibrational energy is transmitted down the length of the wick.
Claims
exact text as granted — not AI-modified1 . A device for cooling a vibroacoustic transducer, said device comprising:
a thermally-conductive and pliable wick connectable at a first end to a metal component of a transducer with a second end of said wick connectable to a thermal sink; wherein said wick is capable of sufficient heat flux.
2 . The device in accordance with claim 1 , said device further comprising a beryllia washer interposed between the first end of said wick and the metal component of the transducer.
3 . The device in accordance with claim 2 wherein the material of said wick is copper.
4 . The device in accordance with claim 2 wherein the material of said wick is silver.
5 . The device in accordance with claim 1 wherein the material of said wick is copper.
6 . The device in accordance with claim 1 wherein the material of said wick is silver.
7 . A system for cooling a vibroacoustic transducer, said device comprising:
a pliable and thermally-conductive wick connectable at a first end to a metal component of a transducer with a second end of said wick connectable to a thermal sink wherein said wick is capable of sufficient heat flux; and a component for thermal conduction interposed within the transducer.
8 . The system in accordance with claim 7 wherein the material of said thermal conduction component is beryllia.
9 . The system in accordance with claim 7 wherein said thermal conduction component is in the shape of a wafer.
10 . The system in accordance with claim 9 wherein the material of said thermal conduction component is beryllia.
11 . The system in accordance with claim 7 said system further comprising a beryllia washer interposed between the first end of said wick and the metal component of the transducer.
12 . The system in accordance with claim 11 wherein the material of said thermal conduction component is beryllia.
13 . The system in accordance with claim 12 wherein the material of said wick is copper.
14 . The system in accordance with claim 12 wherein the material of said wick is silver.
15 . The system in accordance with claim 11 wherein said thermal conduction component is in the shape of a wafer.
16 . The system in accordance with claim 15 wherein the material of said thermal conduction component is beryllia.
17 . The system in accordance with claim 16 wherein the material of said wick is copper.
18 . The system in accordance with claim 16 wherein the material of said wick is silver.
19 . The system in accordance with claim 16 wherein the material of said wick is gold.
20 . The system in accordance with claim 16 wherein the material of said wick is lead.Join the waitlist — get patent alerts
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