Isolated SCR ESD device
Abstract
The present invention discloses an isolated SCR ESD device, comprising: a substrate; a first well located in the substrate, which is floating and has a first conductivity type; a first high density doped region located in the first well and having a second conductivity type; a second well nearby the first well and having the second conductivity type; a second high density doped region located in the second well and having the second conductivity type; and a third high density doped region located in the second well and having the first conductivity type, wherein the first high density doped region is for electrical connection with a pad, and wherein the first well is not provided with a high density doped region having the first conductivity type for connection with the pad.
Claims
exact text as granted — not AI-modified1 . An isolated silicon controlled rectifier (SCR) electro-static discharge (ESD) device comprising:
a substrate; a first well located in the substrate, which is floating and has a first conductivity type; a first high density doped region located in the first well and having a second conductivity type; a second well nearby the first well and having the second conductivity type; a second high density doped region located in the second well and having the second conductivity type; and a third high density doped region located in the second well and having the first conductivity type, wherein the first high density doped region is for electrical connection with a pad, and wherein the first well is not provided with a high density doped region having the first conductivity type for connection with the pad.
2 . The isolated SCR ESD device of claim 1 , wherein the first high density doped region, the first well, the second well, and the third high density doped region constitute an SCR.
3 . The isolated SCR ESD device of claim 1 , wherein the first conductivity type is N-type and the second conductivity type is P-type.
4 . The isolated SCR ESD device of claim 1 , further comprising a fourth high density doped region located at a junction area between the first and second wells.
5 . The isolated SCR ESD device of claim 4 , wherein the fourth high density doped region is the first or second conductivity type.
6 . The isolated SCR ESD device of claim 1 , further comprising a fourth high density doped region located in the first well and with a predetermined distance from a junction area between the first and second wells.
7 . The isolated SCR ESD device of claim 6 , wherein the fourth high density doped region is the first conductivity type.
8 . The isolated SCR ESD device of claim 1 , further comprising a fourth high density doped region located in the second well and with a predetermined distance from a junction area between the first and second wells.
9 . The isolated SCR ESD device of claim 8 , wherein the fourth high density doped region is the second conductivity type.
10 . The isolated SCR ESD device of claim 1 , wherein the second and third high density doped regions are coupled to a grounding pad.Join the waitlist — get patent alerts
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