Substrate processing apparatus and method

Abstract

A bypass route is provided in order to transfer a substrate without passing through the normal pressure transfer chamber, that is, a loader module, from a load lock chamber to a storage. In the bypass route, a sub-transfer unit for transferring the processed substrate from the load lock chamber to the storage is provided. The sub-transfer unit transfers the processed substrate from the load lock chamber to the storage, and a main transfer unit of the loader module returns the processed substrate from the storage to a transport container on holding stage.

1 . A substrate processing apparatus comprising:
 a holding stage on which a transport container receiving a plurality of substrates is placed;   a depressurized process chamber which processes the substrate under a depressurized atmosphere;   a load lock chamber which transfers the substrate from/to the depressurized process chamber, and is switchable between the depressurized atmosphere and a normal pressure atmosphere;   a normal pressure transfer chamber which has a main transfer unit for transferring the substrate received in the transport container from the holding stage to the load lock chamber under the normal pressure atmosphere; and   a storage that holds the processed substrate under an atmosphere of a pressure higher than the pressure of the depressurized atmosphere,   wherein a bypass route is provided in order to transfer the processed substrate from the load lock chamber to the storage without passing through the normal pressure transfer chamber,   a sub-transfer unit is provided in the bypass route for transferring the processed substrate from the load lock chamber to the storage, and   the main transfer unit in the normal pressure transfer chamber transfers the processed substrate from the storage to the transport container on the holding stage.   
     
     
         2 . The substrate processing apparatus of  claim 1 , wherein the load lock chamber comprises a load lock chamber that is exclusive for input and transfers the substrate to the depressurized process chamber, and a load lock chamber that is exclusive for output and transfers the substrate from the depressurized process chamber,
 the main transfer unit in the normal pressure transfer chamber transfers an unprocessed substrate received in the transport container on the holding stage to the load lock chamber exclusive for input, and   the sub-transfer unit in the bypass route transfers the processed substrate from the load lock chamber exclusive for output to the storage.   
     
     
         3 . The substrate processing apparatus of  claim 1 , wherein a carry-in opening, into which the processed substrate is transferred from the bypass route, and a carry-out opening, from which the processed substrate is transferred to the normal pressure transfer chamber, are provided in the storage, and
 gate valves for opening/closing the carry-in opening and the carry-out opening are provided on the carry-in opening and the carry-out opening of the storage.   
     
     
         4 . The substrate processing apparatus according to  claim 1 , wherein the storage comprises a fixing shelf having a plurality of receiving portions for receiving the plurality of processed substrates in an up-and-down direction, and
 the sub-transfer unit comprises an up-and-down driving axis which moves the processed substrate in the up-and-down direction so as to receive the processed substrate in one of the receiving portions that are located at different heights from each other.   
     
     
         5 . The substrate processing apparatus according to  claim 1 , wherein the storage comprises a substrate moving mechanism which includes a plurality of receiving portions for receiving the plurality of processed substrates in an up-and-down direction and elevates and/or descends the plurality of substrates received in the plurality of receiving portions, and
 the sub-transfer unit transfers the processed substrate to one of the receiving portions in the substrate moving mechanism that is elevated or descended to a predetermined level.   
     
     
         6 . The substrate processing apparatus of  claim 5 , wherein the substrate moving mechanism of the storage comprises:
 an endless type belt;   a plurality of supporting portions attached to the belt with predetermined intervals for supporting the plurality of substrates; and   a pulley, on which the belt is placed, circulating the belt,   wherein the belt is circulated so that the plurality of supporting portions are moved in an up-and-down direction and a holding portion moved to one end in the up-and-down direction returns to the other end in the up-and-down direction.   
     
     
         7 . The substrate processing apparatus of  claim 5 , wherein the storage comprises an exhaust device, which exhaust the air in the storage, formed on a lower portion in the storage so that the air flows from an upper portion to the lower portion of the storage, and
 the substrate moving mechanism of the storage elevates the plurality of processed substrates from the lower side of the storage to the upper side of the storage.   
     
     
         8 . A substrate processing method comprising:
 transferring an unprocessed substrate that is received in a transport container on a holding storage from the holding stage to a load lock chamber of a normal pressure atmosphere by a main transfer unit in a normal pressure transfer chamber;   transferring the unprocessed substrate from the load lock chamber to the depressurized process chamber and performing a process with respect to the substrate in a depressurized process chamber;   transferring the processed substrate from the depressurized process chamber to the load lock chamber of a depressurized atmosphere;   switching an inner space of the load lock chamber from the depressurized atmosphere to the normal pressure atmosphere;   transferring the processed substrate from the load lock chamber to a storage;   holding the processed substrate in the storage under an environment of a pressure that is greater than the pressure of the depressurized atmosphere; and   transferring the processed substrate from the storage to the transport container on the holding stage by the main transfer unit of the normal pressure transfer chamber,   wherein the substrate processing method comprises:   transferring the processed substrate from the load lock chamber to the storage without passing through the normal pressure transfer chamber, by a sub-transfer unit formed in a bypass route which bypasses the processed substrate from the load lock chamber to the storage; and   returning the processed substrate from the storage to the transport container of the holding stage by the main transfer unit of the normal pressure transfer chamber.   
     
     
         9 . The substrate processing method of  claim 8 , wherein in the holding of the processed substrate in the storage under the environment having the pressure greater than the pressure in the depressurized atmosphere, products that are generated by a reaction between the processed substrate and the air are removed.