Heat Transfer Device

Abstract

According to one embodiment, a heat transfer device includes an array of elongated pins coupled between a base plate and a cover plate. Each pin has a cross-sectional shape with a major width and a minor width that is perpendicular to the major width, in which the length of the minor width is less than the major width. The cover plate and the base plate forming a plenum for the movement of air across the array of pins along a direction parallel to the major width of each pin.

1 . A heat transfer device comprising:
 an array of elongated pins each having a first end and a second end that is coupled to a base plate configured on a peltier device, each pin having an elliptical shape with a major width and a minor width that is perpendicular to the major width, the length of the minor width being less than the major width, each pin has a height that extends from its first end to its second end, the height to the minor width comprising a ratio that is in the range of 3 to 10; and   a cover plate coupled to the first end of each of the array of pins, the cover plate and the base plate forming a plenum for the movement of air across the array of pins along a direction parallel to the major width of each pin.   
     
     
         2 . A heat transfer device comprising:
 an array of elongated pins each having a first end and a second end that is coupled to a base plate, each pin having a cross-sectional shape with a major width and a minor width that is perpendicular to the major width, the length of one of the minor width or the major width being less than the other; and   a cover plate coupled to the first end of each of the array of pins, the cover plate and the base plate forming a plenum for the movement of air across the array of pins along a direction parallel to the major width of each pin.   
     
     
         3 . The heat transfer device of  claim 2 , wherein the cross-sectional shape comprises an elliptical shape. 
     
     
         4 . The heat transfer device of  claim 2 , wherein the major width extends from a leading edge to a trailing edge, the minor width being closer to the leading edge than the trailing edge. 
     
     
         5 . The heat transfer device of  claim 2 , wherein the major width extends from a leading edge to a trailing edge, the minor width being closer to the trailing edge than the leading edge. 
     
     
         6 . The heat transfer device of  claim 2 , wherein the major width extends from a leading edge to a trailing edge, the leading edge or the trailing comprising an angled contour. 
     
     
         7 . The heat transfer device of  claim 2 , wherein each pin has a height that extends from its first end to its second end, the height to the minor width comprising a ratio that is in the range of 3 to 10. 
     
     
         8 . The heat transfer device of  claim 2 , wherein the base plate is configured on a peltier device. 
     
     
         9 . The heat transfer device of  claim 2 , wherein the array of pins are integrally formed with the base plate using a casting process. 
     
     
         10 . The heat transfer device of  claim 2 , wherein the cover plate is coupled to the first end of each of the array of pins using an adhesive. 
     
     
         11 . The heat transfer device of  claim 2 , wherein the length of the minor width is less than 0.5 of the major width. 
     
     
         12 . A method for manufacturing a heat transfer device comprising:
 forming an array of elongated pins and a base plate, each pin having a first end and a second end that is coupled to the base plate, each pin having a cross-sectional shape with a major width and a minor width perpendicular to the major width, the length of one of the minor width or the major width being less than the other; and   coupling a cover plate to the first end of each of the array of pins, the cover plate and the base plate forming a plenum for the movement of air across the array of pins along a direction parallel to the major width of each pin.   
     
     
         13 . The method of  claim 12 , wherein the cross-sectional shape comprises an elliptical shape. 
     
     
         14 . The method of  claim 12 , wherein the major width extends from a leading edge to a trailing edge, the minor width being closer to the leading edge than the trailing edge. 
     
     
         15 . The method of  claim 12 , wherein the major width extends from a leading edge to a trailing edge, the minor width being closer to the trailing edge than the leading edge. 
     
     
         16 . The method of  claim 12 , wherein the major width extends from a leading edge to a trailing edge, the leading edge or the trailing comprising an angled contour. 
     
     
         17 . The method of  claim 12 , wherein each pin has a height that extends from its first end to its second end, the height to the minor width comprising a ratio that is in the range of 3 to 10. 
     
     
         18 . The method of  claim 12 , further comprising coupling the base plate to a peltier device. 
     
     
         19 . The method of  claim 12 , wherein the array of pins are integrally formed with the base plate using a casting process. 
     
     
         20 . The method of  claim 12 , wherein the cover plate is coupled to the first end of each of the array of pins using an adhesive. 
     
     
         21 . The method of  claim 12 , wherein the length of the minor width is less than 0.5 of the major width.