Polishing apparatus and polishing method

Abstract

A plate material, while being transferred by a transfer mechanism, is sandwiched by two polishing heads. The plate material is transferred by the transfer mechanism while the two polishing heads are vibrated by a vibration mechanism in a direction crossing a transfer direction T of the plate material.

1 . A polishing apparatus, comprising:
 a transfer mechanism configured to transfer a plate material in a prescribed transfer direction;   two polishing heads respectively having polishing surfaces configured to polish corresponding surfaces of the plate material, the two polishing heads being disposed so as to cause the polishing surfaces contact the corresponding surfaces of the plate material so as to sandwich the plate material in a plate-thickness direction therebetween, the two polishing heads being capable of being displaced along the corresponding surfaces and in a displace direction being a direction crossing the transfer direction of the transfer mechanism while allowing for the transfer of the plate material by the transfer mechanism; and   a vibration mechanism configured to vibrate the two polishing heads such that the polishing heads are repeatedly displaced in the displace direction of the polishing heads.   
     
     
         2 . The polishing apparatus of  claim 1 , wherein
 a dimension of each of the polishing surfaces of the polishing heads in the displace direction of the polishing heads is greater than a dimension of the plate material in the displace direction of the polishing heads.   
     
     
         3 . The polishing apparatus of  claim 1 , wherein
 the displace direction of the polishing heads is a direction approximately perpendicular to the transfer direction.   
     
     
         4 . The polishing apparatus of  claim 1 , wherein
 the vibration mechanism is configured to vibrate the two polishing heads such that the two polishing heads are displaced reversely relative to each other.   
     
     
         5 . The polishing apparatus of  claim 1 , further comprising:
 liquid supply means for supplying a liquid on the corresponding surfaces of the plate material while being polished by the polishing heads.   
     
     
         6 . The polishing apparatus of  claim 1 , wherein
 the polishing heads each have a plurality of polishing blocks forming the polishing surfaces of the polishing heads, and   the liquid supply means has a plurality of discharge nozzles disposed among the polishing blocks to discharge a liquid.   
     
     
         7 . A polishing method for polishing both surfaces of a plate material, wherein
 two polishing heads respectively polishing both the surfaces of the plate material are used, and   while the plate material is transferred in a prescribed transfer direction, the two polishing heads are vibrated respectively relative to both the surfaces of the plate material, such that the two polishing heads are repeatedly displaced along corresponding ones of both the surfaces of the plate material and in a displace direction being a direction crossing the transfer direction.