Electronic component and method for manufacturing the same
Abstract
An electronic component is provided with a first conductor, an insulator for covering a surface of the first conductor, a via hole penetrating the insulator, and a second conductor located on a surface of the insulator and electrically connected to the first conductor through the via hole, and includes a shielding film having conductivity, being interposed between the first conductor and the second conductor, and covering an interface between the first conductor and the insulator in the via hole by extending continuously at least from the surface of the first conductor constituting a bottom surface of the via hole to an inner wall surface of the via hole.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . An electronic component comprising:
a first conductor made of a conductive material; an insulator made of an insulative material and configured to cover a surface of the first conductor; a second conductor made of a conductive material and located on a surface of the insulator; a via hole penetrating the insulator; a filler filled in the via hole so as to bury a space inside the via hole; and a shielding film having conductivity, being interposed between the first conductor and the filler, and covering an interface between the first conductor and the insulator in the via hole by extending continuously at least from the surface of the first conductor constituting a bottom surface of the via hole to an inner wall surface of the via hole and further to the surface of the insulator around the via hole.
2 . The electronic component according to claim 1 ,
wherein the second conductor is part of a side surface conductor provided on a side surface of the electronic component, the shielding film is formed to further cover the side surface of the electronic component, and the side surface conductor is formed on the shielding film.
3 . The electronic component according to claim 1 ,
wherein the second conductor is a terminal electrode provided on any of a top surface and a bottom surface of the electronic component.
4 . The electronic component according to claim 1 ,
wherein the shielding film is the film having at least any of resistance to a surfactant treatment fluid inclusive of a degreasing fluid, resistance to an acidic chemical solution, resistance to an alkaline chemical solution, resistance to a solvent, resistance to alcohol, resistance to a plating fluid, resistance to an etching fluid, moisture resistance, gas permeation resistance, and corrosion resistance.Join the waitlist — get patent alerts
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