Film formation apparatus for semiconductor process
Abstract
A film formation apparatus for a semiconductor process for forming a thin film on a target object by use of first and second reactive gases includes a vacuum container, an exhaust system, a rotary table configured to place the target object thereon, a rotating mechanism configured to rotate the rotary table, and a temperature adjusting mechanism configured to set the target object to a temperature at which the first reactive gas is condensed. Inside the vacuum container, a first reactive gas supply section configured to adsorb a condensed substance of the first reactive gas onto the target object, a vaporizing section configured to partly vaporize the condensed substance, and a second reactive gas supply section configured to cause the second reactive gas to react with the condensed substance are disposed in this order in a rotational direction of the rotary table.
Claims
exact text as granted — not AI-modified1 . A film formation apparatus for a semiconductor process for forming a thin film on a target object by use of first and second reactive gases, the apparatus comprising:
a vacuum container; an exhaust system configured to exhaust gas from inside the vacuum container; a rotary table disposed inside the vacuum container and configured to place the target object thereon; a rotating mechanism configured to rotate the rotary table; a temperature adjusting mechanism configured to set the target object on the rotary table to a temperature at which the first reactive gas is condensed; a first reactive gas supply section disposed inside the vacuum container and configured to supply the first reactive gas onto the target object on the rotary table to adsorb a condensed substance of the first reactive gas onto the target object; a vaporizing section disposed inside the vacuum container and configured to heat the target object on the rotary table to partly vaporize the condensed substance; and a second reactive gas supply section disposed inside the vacuum container and configured to supply the second reactive gas in an activated state onto the target object on the rotary table and to cause the second reactive gas to react with the condensed substance to form a reaction product, wherein the first reactive gas supply section, the vaporizing section, and the second reactive gas supply section are disposed in this order in a rotational direction of the rotary table.
2 . The apparatus according to claim 1 , wherein the second reactive gas supply section includes an activating mechanism configured to generate plasma of the second reactive gas or heat the second reactive gas.
3 . The apparatus according to claim 1 , wherein the apparatus further comprises an auxiliary gas supply section disposed between the vaporizing section and the second reactive gas supply section in the rotational direction of the rotary table and configured to transform the condensed substance adsorbed on the target object on the rotary table into a secondary substance less volatile than condensed substance.
4 . The apparatus according to claim 3 , wherein the first reactive gas is a silicon source gas and the auxiliary gas is a gas for transforming the condensed substance into a substance containing one or both of hydroxyl group and moisture as the secondary substance.
5 . The apparatus according to claim 1 , wherein the apparatus further comprises a reformation heating portion configured to heat the target object on the rotary table to reform the reaction product.
6 . The apparatus according to claim 1 , wherein the second reactive gas supply section includes an activating mechanism configured to generate plasma of the second reactive gas, the activating mechanism also serving as a plasma supply section for reforming the reaction product.
7 . The apparatus according to claim 1 , wherein the apparatus further comprises first and second separation sections respectively disposed between the second reactive gas supply section and the first reactive gas supply section and between the first reactive gas supply section and the second reactive gas supply section in the rotational direction of the rotary table and each configured to supply an inactive gas as a separation gas for separating gas atmospheres onto the target object on the rotary table.
8 . The apparatus according to claim 3 , wherein the apparatus further comprises first and second separation sections respectively disposed between the second reactive gas supply section and the first reactive gas supply section and between the first reactive gas supply section and the auxiliary gas supply section in the rotational direction of the rotary table and each configured to supply an inactive gas as a separation gas for separating gas atmospheres onto the target object on the rotary table.
9 . The apparatus according to claim 7 , wherein the vaporizing section also serves as the second separation section and is configured to supply the separation gas in a heated state onto the target object on the rotary table.
10 . The apparatus according to claim 3 , wherein the vacuum container includes a transfer port formed between the auxiliary gas supply section and the second reactive gas supply section in the rotational direction of the rotary table and configured to allow the target object to be loaded and unloaded therethrough between the rotary table and a position outside the vacuum container.
11 . The apparatus according to claim 1 , wherein the rotary table is equipped with a plurality of support pins for supporting the target object, the support pins being configured to assist the target object to be loaded and unloaded to and from the rotary table.
12 . The apparatus according to claim 1 , wherein the exhaust system includes an exhaust port opened inside the vacuum container at a position outside the rotary table in a radial direction.
13 . The apparatus according to claim 1 , wherein the temperature adjusting mechanism includes a heater disposed below the rotary table inside the vacuum container.
14 . The apparatus according to claim 13 , wherein a heater accommodating space is defined by a cover member disposed outside the heater in a radial direction and extending upward from a bottom of the vacuum container to a position close to a lower surface of the rotary table, and a purge gas supply system is connected to the heater accommodating space to supply an inactive gas as a purge gas.
15 . The apparatus according to claim 1 , wherein the first and second reactive gas supply sections respectively include first and second reactive gas nozzles disposed above the rotary table inside the vacuum container and configured to respectively supply the first and second reactive gases downward.
16 . The apparatus according to claim 1 , wherein the vaporizing section includes a gas nozzle disposed above the rotary table inside the vacuum container and configured to supply a heated inactive gas downward.
17 . The apparatus according to claim 7 , wherein each of the first and second separation sections includes a separation gas nozzle disposed above the rotary table inside the vacuum container and configured to supply the separation gas downward, and a ceiling of the vacuum container is set lower on opposite sides of the separation gas nozzle in the rotational direction of the rotary table.
18 . The apparatus according to claim 5 , wherein the reformation heating portion includes a reformation heater disposed above the rotary table inside the vacuum container, and the reformation heater is present between the second reactive gas supply section and the first reactive gas supply section in the rotational direction of the rotary table.
19 . The apparatus according to claim 1 , wherein the apparatus further comprises a separation gas supply system disposed above a center of the rotary table inside the vacuum container and configured to supply an inactive gas as a separation gas for separating gas atmospheres.
20 . The apparatus according to claim 1 , wherein the rotary table is configured to place a plurality of target objects thereon side by side in the rotational direction of the rotary table.Join the waitlist — get patent alerts
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