Manufacturing process of a high efficiency heat dissipating device

Abstract

A manufacturing process of a high efficiency heat dissipating device includes a plate or cylinder base, and a plurality of fins assembled to the base. The base and the fins are made of aluminum. An oxide layer to improve heat radiating are formed to surface of the base or the fins by an anodizing process. A heat pipe is additionally arranged to conduct the heat from the base to the fins. Or, in a heat dissipating device consists of the heat pipe and the fins, oxide layers are formed to the surfaces of the fins by the anodizing process. By the above structure, a heat radiating effect is improved and a visible appearance, an anti-pollution ability are formed to the heat dissipating device.

1 . A manufacturing process of a high efficiency heat dissipating device comprising the step of assembling a plurality of fins to a base;
 performing an anodizing process, an oxide layer for improving a heat radiating effect being formed to a surface of at least one of the base or the fins.   
     
     
         2 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 1 , wherein at least one of the base and the fins are made of aluminum; an aluminum oxide layer is formed to the surface of at least one of the base and the fins by the anodizing process to improve the heat radiating effect. 
     
     
         3 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 2 , wherein colors and thicknesses of the oxide layer of the base and the fins are controllable by adjusting voltages and process time of the anodizing process. 
     
     
         4 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 2 , wherein at least one of the base and the fins is anodized separately to form the high heat radiating oxide layer onto the surface thereof; and then tightly combining the base and the fins together as a finished heat dissipating device by a combining process. 
     
     
         5 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 2 , wherein the base and the fins are combined together as a heat dissipating device firstly, and then the heat dissipating device is anodized to form oxide layers onto surfaces of the base and the fins. 
     
     
         6 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 2 , comprising the step of arranging one end of at least one heat pipe tightly to the base, and another end thereof is arranged to the fins; oxide layers are formed to the surfaces of the base and the fins by the anodizing process to improve the heat radiating effect. 
     
     
         7 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 6 , wherein an oxide layer is formed to a surface of the heat pipe by the anodizing process. 
     
     
         8 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 2 , wherein the base is a plate body with a shape of one of a rectangle, a circle, a geometrical shape, and an irregular shape. 
     
     
         9 . A manufacturing process of a high efficiency heat dissipating device comprising steps of: assembling a plurality of fins assembled to at least one heat pipe;
 by an anodizing process, an oxide layer for improving a heat radiating effect being formed to a surface of at least one of the heat pipe and the fins.   
     
     
         10 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 9 , wherein the fins is made of aluminum; the oxide layer of aluminum oxide is formed to the surfaces of the fins to improve the heat radiating effect. 
     
     
         11 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 10 , wherein color and thickness of the oxide layer of the fins are controllable by adjusting voltages and process time of the anodizing process. 
     
     
         12 . A manufacturing process of a high efficiency heat dissipating device comprising the steps of assembling a plurality of fins assembled to an outer surface of a cylindrical base; and
 by an anodizing process, an oxide layer being formed to a surface of at least one of the base and the fins to improve a heat radiating effect.   
     
     
         13 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 12 , wherein at least one of the base and the fins are made of aluminum; by the anodizing process, the oxide layer of aluminum oxide are formed to the surface of at least one of the base and the fins to improve the heat radiating effect. 
     
     
         14 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 13 , wherein colors and thickness of the oxide layer of at least one of the base and the fins are controllable by adjusting voltages and process time of the anodizing process. 
     
     
         15 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 13 , wherein the oxide layer is formed to the surface of at least one of the cylindrical base and fins to improve the heat radiating effect; and then the base and the fins are tightly combined together by a combining process. 
     
     
         16 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 13 , wherein the base and the fins are tightly combined together to be as a heat dissipating device by a combining process; by anodizing the heat dissipating device, oxide layers are formed to the base and the fins. 
     
     
         17 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 13 , wherein a carrier is arranged to one of an end or an inside of the base for being installed by a heat source. 
     
     
         18 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 17 , wherein the oxide layer is formed to a surface of the carrier by the anodizing process to improve the heat radiating effect. 
     
     
         19 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 13 , wherein the base and the fins being formed integrally; the oxide layer is formed to at least one of the base and the fins by the anodizing process to improve the heat radiating effect. 
     
     
         20 . The manufacturing process of a high efficiency heat dissipating device as claimed in  claim 19 , wherein a carrier is arranged to one of an end or an inside of the base for being installed by a heat source.