US2011032036A1PendingUtilityA1

Performance tuning using encoded performance parameter information

Assignee: ST MICROELECTRONICS INCPriority: Jun 5, 2002Filed: Oct 20, 2010Published: Feb 10, 2011
Est. expiryJun 5, 2022(expired)· nominal 20-yr term from priority
H02P 6/34Y10T29/49004
46
PatentIndex Score
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Claims

Abstract

A multi-chip system in which at least one of the chips includes a performance parameter encoded thereon. After system assembly, the performance parameter can be obtained by a companion chip and used to automatically or semi-automatically fine tune the companion chip to the specific parameters of the at least one chip.

Claims

exact text as granted — not AI-modified
1 . A method comprising:
 fabricating a device including a signature file memory;   testing the device to determine one or more performance parameters;   storing the parameters in the signature file memory; and   packaging the device.   
     
     
         2 . The method of  claim 1  wherein the parameters are stored directly in the signature file memory. 
     
     
         3 . The method of  claim 1  wherein the parameters are stored in encoded form in the signature file memory. 
     
     
         4 . The method of  claim 1  wherein the testing and storing are performed at wafer-level. 
     
     
         5 . The method of  claim 1  further comprising testing the packaged devices. 
     
     
         6 . The method of  claim 5  wherein testing the packaged devices comprises parametric testing. 
     
     
         7 . The method of  claim 5  wherein testing comprises sorting algorithms. 
     
     
         8 . The method of  claim 5  further comprising using parametric testing information to write to the device signature file. 
     
     
         9 . The method of  claim 8  further comprising accessing the signature file through an existing lead of the packaged device. 
     
     
         10 . The method of  claim 9  wherein the accessing is performed using multiplexing. 
     
     
         11 . The method of  claim 8  wherein the packaged device includes a serial port that is configured by a control signal on an existing lead to access the signature file memory. 
     
     
         12 . The method of  claim 8  further comprising assembling a multi-chip system using the packaged device. 
     
     
         13 . The method of  claim 12  further comprising coupling the packaged device to a logic device that is capable of reading the signature file and adapting some feature of the multi-chip system behavior to the value stored in the signature file. 
     
     
         14 . The method of  claim 12  wherein a multiplexing mechanism used to write data to the device signature file is used to read data from the device signature file. 
     
     
         15 . The method of  claim 12  wherein the multi-chip system self tunes using a value stored in the device signature file. 
     
     
         16 . The method of  claim 12  further comprising using multiple signature files in systems with multiple chips. 
     
     
         17 . The method of  claim 12  further comprising using an algorithm to compute a compensation factor that accounts for a particular device performance indicated by the device signature. 
     
     
         18 . The method of  claim 12  further comprising using the packaged device signature to access a look-up table of stored compensation factors. 
     
     
         19 . A method of using a multi-chip integrated circuit system comprising using a signature file on one of the chips to adjust the gain of an amplifier to affect input/output impedance matching. 
     
     
         20 . A method of using a multi-chip integrated circuit system comprising using a signature file on one of the chips to match a driver more accurately to a driven load.

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