Heat dissipation structure and heat dissipation system adopting the same

Abstract

A heat dissipation structure includes a thermal interface material and a transition layer. The thermal interface material includes a matrix and a plurality of carbon nanotubes dispersed in the matrix. The thermal interface material has a first surface and a second surface opposite to the first surface. The transition layer is positioned on one of the first surface or the second surface of the thermal interface material. A thickness of the transition layer is in a range from about 1 nanometer to about 100 nanometers. The transition layer is in contact with the carbon nanotubes of the thermal interface material. An interface thermal resistance between the transition layer and the heat source is less than that between the plurality of carbon nanotubes and the heat source. The present application also relates to a heat dissipation system adopting the heat dissipation structure.

1 . A heat dissipation structure for dissipating heat from a heat source, comprising:
 a thermal interface material comprising a matrix and a plurality of carbon nanotubes dispersed in the matrix, the thermal interface material having a first surface and a second surface opposite to the first surface; and   a transition layer positioned on one of the first surface or the second surface of the thermal interface material, wherein a thickness of the transition layer is in a range from about  1  nanometer to about  100  nanometers; the transition layer contacts with the carbon nanotubes of the thermal interface material; an interface thermal resistance between the transition layer and the heat source is less than that between the plurality of carbon nanotubes and the heat source.   
     
     
         2 . The heat dissipation structure of  claim 1 , wherein the plurality of carbon nanotubes is substantially parallel to each other and substantially perpendicular to the first surface and the second surface of the thermal interface material. 
     
     
         3 . The heat dissipation structure of  claim 2 , wherein ends of at least some of the plurality of carbon nanotubes protrude out of one of the first surface and the second surface, and are embedded in the transition layer. 
     
     
         4 . The heat dissipation structure of  claim 3 , wherein the transition layer is positioned at each of the first surface and the second surface. 
     
     
         5 . The heat dissipation structure of  claim 4 , wherein two ends of the plurality of carbon nanotubes extend out of the first and second surfaces of the thermal interface material and are buried in the transition layers. 
     
     
         6 . The heat dissipation structure of  claim 1 , wherein a mass percent of the plurality of carbon nanotubes in the thermal interface material is in a range from about 0.1% to 5%. 
     
     
         7 . The heat dissipation structure of  claim 1 , wherein a material of the transition layer is selected from the group consisting of silicone, polyethylene glycol, polyethylene, polyester, epoxy resin, hypoxia glue, glue series of acrylic, and rubber. 
     
     
         8 . The heat dissipation structure of  claim 1 , further comprising a plurality of thermal conductive particles dispersed in the matrix. 
     
     
         9 . The heat dissipation structure of  claim 8 , wherein the thermal conductive particles are at least one of metal particles, alloy particles, oxide particles, and non-metal particles. 
     
     
         10 . The heat dissipation structure of  claim 1 , wherein a thickness of the transition layer is about 50 nanometers. 
     
     
         11 . A heat dissipation system, comprising:
 a heat sink;   a heat source; and   a heat dissipation structure positioned between the heat sink and the heat source, the heat dissipation structure comprising a thermal interface material and a transition layer, the thermal interface material comprising a matrix and a plurality of carbon nanotubes dispersed in the matrix, the thermal interface material having a first surface and a second surface opposite to the first surface, and the transition layer being positioned on one of the first surface or the second surface of the thermal interface material, wherein a thickness of the transition layer is in a range from about  1  nanometer to about 100 nanometers; the transition layer contacts with the carbon nanotubes of the thermal interface material; an interface thermal resistance between the transition layer and the heat source or the heat sink is less than that between the plurality of carbon nanotubes and the heat source or the heat sink.   
     
     
         12 . The heat dissipation system of  claim 11 , wherein the plurality of carbon nanotubes is substantially parallel to each other and substantially perpendicular to the first surface and the second surface of the thermal interface material. 
     
     
         13 . The heat dissipation system of  claim 11 , wherein one end of at least some carbon nanotubes of the plurality of carbon nanotubes extends out of one surface of the thermal interface material and is buried in the transition layer. 
     
     
         14 . The heat dissipation system of  claim 11 , wherein the transition layer comprises a first transition layer and a second transition layer opposite to the first transition layer the first transition layer is positioned between the heat sink and the thermal interface material, and the second transition layer is positioned between the heat source and the thermal interface material. 
     
     
         15 . The heat dissipation system of  claim 14 , wherein two ends of the plurality of carbon nanotubes extend out of the first and second surfaces of the thermal interface material and are buried in the first and second transition layers.