Method for manufacturing semiconductor substrate and semiconductor substrate manufacturing apparatus

Abstract

An object is to provide a uniform semiconductor substrate in which defective bonding is reduced. A further object is to manufacture the semiconductor substrate with a high yield. A first substrate and a second substrate are bonded in a reduced-pressure atmosphere by placing the first substrate at a certain region surrounded by an airtight holding mechanism provided over a support to surround the certain region of a surface of the support; placing the second substrate so as to come to be in contact with the airtight holding mechanism to ensure airtightness of a space surrounded by the support, the airtight holding mechanism, and the second substrate; evacuating the space whose airtightness is secured, thereby reducing an pressure in the space; disposing the second substrate in close contact with the first substrate using difference between the pressure in the space and outside atmospheric pressure; and performing heat treatment.

1 . A semiconductor substrate manufacturing apparatus comprising:
 a support;   an airtight holding mechanism provided so as to surround a region of a surface of the support;   a vacuum pump connected to the region; and   a heating means.   
     
     
         2 . The semiconductor substrate manufacturing apparatus according to  claim 1 , wherein the airtight holding mechanism comprises an elastic body in a part. 
     
     
         3 . The semiconductor substrate manufacturing apparatus according to  claim 2 , wherein any of silicone rubber, fluorine-based rubber, or perfluoro-rubber is used as the elastic body. 
     
     
         4 . The semiconductor substrate manufacturing apparatus according to  claim 1 , wherein the airtight holding mechanism comprises a function of adjusting its own height. 
     
     
         5 . A semiconductor substrate manufacturing apparatus in which two substrates are bonded, comprising:
 a support for placing a first substrate;   an airtight holding mechanism, which is provided over a surface of the support so as to surround a region for placing the first substrate and to support a second substrate;   a vacuum pump for evacuating a space surrounded by the support, the airtight holding mechanism, and the second substrate; and   a means for heating the first substrate and the second substrate.   
     
     
         6 . The semiconductor substrate manufacturing apparatus according to  claim 5 , wherein the airtight holding mechanism comprises an elastic body in a part. 
     
     
         7 . The semiconductor substrate manufacturing apparatus according to  claim 6 , wherein any of silicone rubber, fluorine-based rubber, or perfluoro-rubber is used as the elastic body. 
     
     
         8 . The semiconductor substrate manufacturing apparatus according to  claim 5 , wherein the airtight holding mechanism comprises a function of adjusting its own height.