Thermoplastic elastomers exhibiting superior barrier properties

Abstract

A blend of styrene-isobutylene-styrene based thermoplastic elastomer and organoclay-filled polyamide is disclosed which has good processability and more effective barrier properties for oxygen than the blend using amorphous or crystalline polyamide without organoclay.

What is claimed is: 
     
         1 . A thermoplastic elastomer compound, comprising:
 (a) styrene-isobutylene-styrene (SIBS) and   (b) polyamide including organoclay dispersed in the polyamide.   
     
     
         2 . The compound of  claim 1 , further comprising plasticizer oil. 
     
     
         3 . The compound of  claim 1 , further comprising filler. 
     
     
         4 . The compound of  claim 1 , further comprising additives selected from the group consisting of adhesion promoters; biocides (antibacterials, fungicides, and mildewcides), anti-fogging agents; anti-static agents; bonding, blowing and foaming agents; dispersants; fillers and extenders; fire and flame retardants and smoke suppresants; impact modifiers; initiators; lubricants; micas; pigments, colorants and dyes; oils and plasticizers; processing aids; release agents; silanes, titanates and zirconates; slip and anti-blocking agents; stabilizers; stearates; ultraviolet light absorbers; viscosity regulators; waxes; and combinations of them. 
     
     
         5 . The compound of  claim 1 , wherein the SIBS comprises from about 20 to about 90 weight percent of the compound and wherein the organoclay dispersed polyamide comprises from about 5 to about 50 weight percent of the compound. 
     
     
         6 . The compound of  claim 1 , wherein the organoclay is exfoliated within the polyamide, and wherein the organoclay comprises between about 1 and about 8 weight percent of a combination of organoclay dispersed polyamide. 
     
     
         7 . A molded article, comprising a compound of  claim 1 . 
     
     
         8 . A method of using the compound of  claim 1 , wherein the method comprises the step of molding the compound into an article that has more than about 280% improvement in reduced oxygen transmission than a compound which has the same SIBS and polyamide but no organoclay. 
     
     
         9 . The compound of  claim 2 , further comprising filler. 
     
     
         10 . The compound of  claim 2 , further comprising additives selected from the group consisting of adhesion promoters; biocides (antibacterials, fungicides, and mildewcides), anti-fogging agents; anti-static agents; bonding, blowing and foaming agents; dispersants; fillers and extenders; fire and flame retardants and smoke suppresants; impact modifiers; initiators; lubricants; micas; pigments, colorants and dyes; oils and plasticizers; processing aids; release agents; silanes, titanates and zirconates; slip and anti-blocking agents; stabilizers; stearates; ultraviolet light absorbers; viscosity regulators; waxes; and combinations of them. 
     
     
         11 . The compound of  claim 2 , wherein the SIBS comprises from about 20 to about 90 weight percent of the compound and wherein the organoclay dispersed polyamide comprises from about 5 to about 50 weight percent of the compound. 
     
     
         12 . The compound of  claim 2 , wherein the organoclay is exfoliated within the polyamide, and wherein the organoclay comprises between about 1 and about 8 weight percent of a combination of organoclay dispersed polyamide. 
     
     
         13 . The molded article of  claim 7 , wherein the compound further comprises filler. 
     
     
         14 . The molded article of  claim 7 , wherein the compound further comprises additives selected from the group consisting of adhesion promoters; biocides (antibacterials, fungicides, and mildewcides), anti-fogging agents; anti-static agents; bonding, blowing and foaming agents; dispersants; fillers and extenders; fire and flame retardants and smoke suppresants; impact modifiers; initiators; lubricants; micas; pigments, colorants and dyes; oils and plasticizers; processing aids; release agents; silanes, titanates and zirconates; slip and anti-blocking agents; stabilizers; stearates; ultraviolet light absorbers; viscosity regulators; waxes; and combinations of them. 
     
     
         15 . The molded article of  claim 7 , wherein the SIBS comprises from about 20 to about 90 weight percent of the compound and wherein the organoclay dispersed polyamide comprises from about 5 to about 50 weight percent of the compound. 
     
     
         16 . The molded article of  claim 7 , wherein the organoclay is exfoliated within the polyamide, and wherein the organoclay comprises between about 1 and about 8 weight percent of a combination of organoclay dispersed polyamide. 
     
     
         17 . The method of  claim 8 , wherein the compound further comprises filler. 
     
     
         18 . The method of  claim 8 , wherein the compound further comprises additives selected from the group consisting of adhesion promoters; biocides (antibacterials, fungicides, and mildewcides), anti-fogging agents; anti-static agents; bonding, blowing and foaming agents; dispersants; fillers and extenders; fire and flame retardants and smoke suppresants; impact modifiers; initiators; lubricants; micas; pigments, colorants and dyes; oils and plasticizers; processing aids; release agents; silanes, titanates and zirconates; slip and anti-blocking agents; stabilizers; stearates; ultraviolet light absorbers; viscosity regulators; waxes; and combinations of them. 
     
     
         19 . The method of  claim 8 , wherein the SIBS comprises from about 20 to about 90 weight percent of the compound and wherein the organoclay dispersed polyamide comprises from about 5 to about 50 weight percent of the compound. 
     
     
         20 . The method of  claim 8 , wherein the organoclay is exfoliated within the polyamide, and wherein the organoclay comprises between about 1 and about 8 weight percent of a combination of organoclay dispersed polyamide.