US2011027970A1PendingUtilityA1
Method for dicing wafer and process for manufacturing liquid-discharging head using the dicing method
Est. expiryApr 28, 2024(expired)· nominal 20-yr term from priority
H10P 72/0428Y10T156/1158B41J 2/1603Y10T156/1062B41J 2/1632Y10T156/1064Y10S438/976Y10T156/1082
49
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Claims
Abstract
A method for dicing a wafer having a first face in which opening are arranged along dicing streets. The method includes a step of affixing a dicing tape to the first face such that the dicing tape lies over the openings and adhesive regions of the dicing tape are exposed in the openings and a step of treating the dicing tape to reduce the adhesive strength of the adhesive regions.
Claims
exact text as granted — not AI-modified1 . A method for dicing a wafer having a first face, dicing streets, and openings defined in the first face and arranged along the dicing streets, the method comprising the steps of: affixing a dicing tape having adhesive regions to the first face such that the dicing tape lies over the openings and the adhesive regions are exposed in the openings; and treating the dicing tape to reduce an adhesive strength of the adhesive regions.
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