Systems and methods for composite structures with embedded interconnects

Abstract

A composite interconnect assembly includes a body structure formed from a composite material (e.g., a carbon graphite material) with one or more conductive traces embedded therein (e.g., a copper or copper alloy). One or more contact regions are provided such that the conductive traces are exposed and are configured to mechanically and electrically connect to one or more electronic components. The body structure may have a variety of shapes, including planar, cylindrical, conical, and the like.

1 . A composite interconnect assembly comprising:
 a body structure comprising a composite material;   a conductive trace embedded within the body structure;   a contact region defined on the body structure such that the conductive trace is exposed and is configured to mechanically and electrically connect to an external electronic component.   
     
     
         2 . The composite interconnect assembly of  claim 1 , wherein the body is generally planar. 
     
     
         3 . The composite interconnect assembly of  claim 2 , wherein the body structure has a thickness of less than approximately 1.5 mm. 
     
     
         4 . The composite interconnect assembly of  claim 1 , wherein the body structure is generally tubular. 
     
     
         5 . The composite interconnect assembly of  claim 1 , wherein the composite material is a carbon graphite material. 
     
     
         6 . The composite interconnect assembly of  claim 1 , wherein the conductive trace comprises copper. 
     
     
         7 . The composite interconnect assembly of  claim 1 , wherein the contact region is an opening in the body structure extending to the conductive trace. 
     
     
         8 . The composite interconnect assembly of  claim 1 , wherein the contact region is a bond pad substantially flush with the body structure. 
     
     
         9 . The composite interconnect assembly of  claim 1 , wherein the contact region is a through-hole structure. 
     
     
         10 . The composite interconnect assembly of  claim 1 , further comprising a plurality of conductive traces configured within multiple levels. 
     
     
         11 . The composite interconnect assembly of  claim 1 , wherein the body structure comprises at least two layers. 
     
     
         12 . A method of making a composite interconnect assembly, comprising:
 forming a body structure comprising a composite material;   embedding a conductive trace within the body structure;   defining a contact region on the body structure such that the conductive trace is exposed and is configured to mechanically and electrically connect to an external electronic component.   
     
     
         13 . The method of  claim 12 , including forming the body generally planar. 
     
     
         14 . The method of  claim 12 , including forming the body structure such that it has a thickness of less than approximately 1.5 mm. 
     
     
         15 . The method of  claim 12 , including forming the body structure generally tubular. 
     
     
         16 . The method of  claim 12 , wherein the composite material is a carbon graphite material. 
     
     
         17 . The method of  claim 12 , wherein the conductive trace comprises copper. 
     
     
         18 . The method of  claim 12 , wherein the contact region is an opening in the body structure extending to the conductive trace. 
     
     
         19 . The method of  claim 12 , further including forming a plurality of conductive traces within multiple levels of the body structure. 
     
     
         20 . A composite interconnect assembly comprising:
 a body structure comprising a composite material having a plurality of levels;   a plurality of conductive traces embedded within the plurality of levels;   a plurality of contact regions defined on a surface of the body structure such that at least a portion of the plurality of conductive traces are exposed and are configured to mechanically and electrically connect to an external electronic component.