Cooling apparatus for semiconductor component

Abstract

Disclosed is a cooling apparatus for a semiconductor component having a coolant inlet flow path on a coolant flow path connecting a coolant inlet and a coolant outlet, the coolant inlet flow path having a diffuser shape, in which its cross-sectional area increases from a coolant inlet to a portion where cooling fins start to appear. In the cooling apparatus, the coolant inlet flow path meets the following equation: ω= D {3/2+sin(α( x−A ))}. Here, ω is the radius of the diffuser, D is the diameter of the coolant inlet, x is a distance from the coolant inlet toward the cooling fins, α is an expansion slope coefficient of the diffuser in radians, and the sine of (α·A) is 1. In the cooling apparatus for a compact and integrated semiconductor component, since the diffuser-shaped coolant inlet flow path extending from the coolant inlet to the cooling fins is designed in an optimal shape, it is possible to improve cooling efficiency and to reduce flow resistance to coolant flow.

What is claimed is: 
     
         1 . A cooling apparatus for a semiconductor component having a coolant inlet flow path on a coolant flow path connecting a coolant inlet and a coolant outlet,
 wherein the coolant inlet flow path has a diffuser shape, in which its cross-sectional area increases from a coolant inlet to a portion where cooling fins start to appear, and meets the following equation:
   ω= D{ 3/2+sin(α( x−A ))} in which
 
   ω is the radius of the diffuser, D is the diameter of the coolant inlet, x is a distance along the diffuser measured from the coolant inlet toward the cooling fins, α is an expansion slope coefficient of the diffuser in radians, and the sine of (α·A) is 1.   
     
     
         2 . The cooling apparatus according to  claim 1 , wherein the range of x is 0≦x≦6.5D. 
     
     
         3 . The cooling apparatus according to  claim 1 , wherein the range of A is 3D≦A≦3.5D and the range of a meets π/7D≦α≦π/6D. 
     
     
         4 . The cooling apparatus according to  claim 1 , wherein said cooling fins are grouped to form a heat sink in the coolant flow path. 
     
     
         5 . The cooling apparatus according to  claim 4 , wherein the heat sink is connected to a semiconductor component corresponding to the heat sink. 
     
     
         6 . A cooling apparatus for a semiconductor component, said cooling apparatus comprising:
 a main body comprising a coolant flow path extending from a coolant inlet to a coolant outlet; and   a number of cooling fins formed in the coolant flow path to cross the coolant flow path,   wherein the coolant flow path comprise a coolant inlet flow path formed in a diffuser shape of which cross-sectional area increases from the coolant inlet to a portion where the cooling fins start to appear and whose profile is a curve.   
     
     
         7 . The cooling apparatus according to  claim 6 , wherein the curve is a sine function graph shape. 
     
     
         8 . The cooling apparatus according to  claim 6 , wherein said cooling fins are grouped to form a heat sink in the coolant flow path. 
     
     
         9 . The cooling apparatus according to  claim 8 , wherein the heat sink is connected to a semiconductor component corresponding to the heat sink.