Process for producing composite material comprising resin molded product

Abstract

The present invention provides a method for allowing a metal complex to stably penetrate into a polymer and immobilizing the metal complex in the polymer by a low temperature treatment, in a batch processing for a plating pre-treatment wherein the metal complex is allowed to penetrate into the polymer with the use of high-pressure carbon dioxide. In particular, the present invention provides a method for producing a composite material containing a resin molded product, characterized in that a reducing agent is brought into contact with the resin molded product so as to allow the reducing agent to penetrate into the resin molded product, and in that high-pressure carbon dioxide having an organic metal complex dissolved therein is brought into contact with the resin molded product into which said reducing agent has penetrated, so as to immobilize the organic metal complex in the resin molded product by the reducing agent.

1 . A method for producing a composite material containing a resin molded product, said method being characterized by comprising the steps of
 bringing a reducing agent into contact with said resin molded product to allow said reducing agent to penetrate into said resin molded product, and   bringing high-pressure carbon dioxide having an organic metal complex dissolved therein, into contact with said resin molded product into which said reducing agent had penetrated, so as to immobilize said organic metal complex in said resin molded product by said reducing agent.   
     
     
         2 . The method according to  claim 1 , wherein said reducing agent is removed from the surface layer of said resin molded product into which said reducing agent had penetrated, and then, said resin molded product is brought into contact with said high-pressure carbon dioxide having said organic metal complex dissolved therein. 
     
     
         3 . The method according to  claim 1 , wherein said high-pressure carbon dioxide having said organic metal complex dissolved therein is brought into contact with said resin molded product under an atmosphere at a temperature lower than a thermal reduction temperature of said organic metal complex. 
     
     
         4 . The method according to  claim 1 , wherein a plating film is further formed on said resin molded product having said organic metal complex immobilized therein, by an electroless plating method with the use of high-pressure carbon dioxide. 
     
     
         5 . The method according to  claim 3 , wherein, after the immobilization of said organic metal complex, said resin molded product is further heated at a temperature higher than the thermal reduction temperature of said organic metal complex. 
     
     
         6 . The method according to  claim 5 , wherein said treatment for heating said resin molded product at the temperature higher than the thermal reduction temperature of said organic metal complex is carried out after said organic metal complex has been recovered from a reaction system. 
     
     
         7 . The method according to  claim 5 , wherein, after said treatment for heating said resin molded product at the temperature higher than the thermal reduction temperature of said organic metal complex, a plating film is further formed on said resin molded product by an electroless plating method with the use of high-pressure carbon dioxide. 
     
     
         8 . The method according to  claim 1 , wherein said reducing agent is dissolved in a solvent and is then brought into contact with said resin molded product. 
     
     
         9 . The method according to  claim 8 , wherein said solvent contains high-pressure carbon dioxide. 
     
     
         10 . The method according to  claim 8 , wherein said solvent contains water or an alcohol. 
     
     
         11 . The method according to  claim 1 , wherein said organic metal complex contains a fluorine atom. 
     
     
         12 . The method according to  claim 1 , wherein said organic metal complex contains at least one metal element selected from Pd, Pt, Ni, Cu and Ag. 
     
     
         13 . The method according to  claim 1 , wherein said high-pressure carbon dioxide in which said organic metal complex is dissolved is in a supercritical state.