Method for manufacturing substrate structure

Abstract

A method for manufacturing a substrate structure includes providing a substrate, forming a plurality of banks on the substrate, the banks and the substrate cooperatively defining a plurality of accommodating rooms, dispensing ink into accommodating rooms in such a manner that the ink covers portions of the banks located between at least two adjacent accommodating rooms using a dispenser, and solidifying the ink in the accommodating rooms to form a patterned layer.

1 . A method for manufacturing a substrate structure, comprising the steps of:
 providing a substrate;   forming a plurality of banks on the substrate, the banks and the substrate cooperatively defining a plurality of accommodating rooms;   dispensing ink into accommodating rooms in such a manner that the ink covers portions of the banks located between at least two adjacent accommodating rooms using a dispenser; and   solidifying the ink in the accommodating rooms to form a patterned layer.   
     
     
         2 . The method as claimed in  claim 1 , wherein the banks are formed using photolithography. 
     
     
         3 . The method as claimed in  claim 1 , wherein the banks have a roughly equal height. 
     
     
         4 . The method as claimed in  claim 1 , wherein the patterned layer is thicker than the bank. 
     
     
         5 . The method as claimed in  claim 1 , wherein the dispenser is an ink jet device. 
     
     
         6 . The method as claimed in  claim 1 , wherein the ink is solidified using at least one solidifying device selected from the group consisting of a vacuumizing device, a heating device and a light-emitting device. 
     
     
         7 . The method as claimed in  claim 6 , wherein the light-emitting device comprises an ultraviolet light-emitting device. 
     
     
         8 . The method as claimed in  claim 1 , further comprising the following step after the ink is solidified: forming an overcoat layer covering the banks and the patterned layer. 
     
     
         10 . The method as claimed in  claim 8 , further comprising the following step after the overcoat layer is formed: forming an electrically conductive layer covering the overcoat layer. 
     
     
         11 . The method as claimed in  claim 1 , further comprising the following step after the ink is solidified: forming an electrically conductive layer covering the banks and the patterned layer.