Semiconductor module

Abstract

A semiconductor module includes a semiconductor chip having a switching function, a resin portion that covers the chip, terminals, and a heat dissipation portion. The resin portion includes first and second surfaces, which are opposed to each other and expand generally parallel to an imaginary plane; and a substrate is located on a first surface-side of the resin portion. The terminals project from the resin portion in a direction of the imaginary plane and are soldered onto the substrate. The heat dissipation portion is disposed on a second surface-side of the resin portion to release heat generated in the chip. One of the terminals is connected to the heat dissipation portion such that heat is transmitted from the one of the terminals to the heat dissipation portion.

1 . A semiconductor module adapted to be packaged on a substrate, the semiconductor module comprising:
 a semiconductor chip that has a switching function;   a resin portion that is formed to cover the semiconductor chip, wherein:
 the resin portion includes a first surface and a second surface, which are opposed to each other and expand generally parallel to an imaginary plane; and 
 the substrate is located on a first surface-side of the resin portion; 
   a plurality of terminals that project from the resin portion in a direction of the imaginary plane and are soldered onto the substrate; and   a heat dissipation portion that is disposed on a second surface-side of the resin portion to release heat generated in the semiconductor chip, wherein one of the plurality of terminals is connected to the heat dissipation portion such that heat is transmitted from the one of the plurality of terminals to the heat dissipation portion.   
     
     
         2 . The semiconductor module according to  claim 1 , wherein an area of a section of the heat dissipation portion parallel to the imaginary plane is equal to or larger than an area of a section of the resin portion parallel to the imaginary plane. 
     
     
         3 . The semiconductor module according to  claim 1 , wherein a thickness of the heat dissipation portion in a direction perpendicular to the imaginary plane is equal to or larger than a thickness of the resin portion in the direction perpendicular to the imaginary plane. 
     
     
         4 . The semiconductor module according to  claim 1 , wherein the heat dissipation portion includes an elongated groove on a surface of the heat dissipation portion, which is on an opposite side of the heat dissipation portion from the second surface-side. 
     
     
         5 . The semiconductor module according to  claim 1 , wherein:
 the resin portion includes a heat conduction portion on the first surface-side of the resin portion; and   the heat conduction portion releases heat toward the substrate.   
     
     
         6 . The semiconductor module according to  claim 5 , wherein the heat conduction portion is formed from thermal conductive resin. 
     
     
         7 . The semiconductor module according to  claim 5 , wherein the heat conduction portion is formed from a metallic material. 
     
     
         8 . The semiconductor module according to  claim 1 , wherein:
 the resin portion includes a heat insulation portion on the first surface-side of the resin portion; and   the heat insulation portion limits conduction of heat toward the substrate.   
     
     
         9 . The semiconductor module according to  claim 1 , wherein the resin portion includes a lateral heat dissipation portion, which projects from a lateral side of the resin portion that is located between the first surface and the second surface of the resin portion.