US2011012054A1PendingUtilityA1

Material With Enhanced Thermal Properties

Assignee: TWIST ENGINE INCPriority: Aug 14, 2006Filed: Sep 23, 2010Published: Jan 20, 2011
Est. expiryAug 14, 2026(~0 yrs left)· nominal 20-yr term from priority
Inventors:Jack C. Priegel
Y10S264/31C04B 26/16C04B 28/02C08J 3/203C04B 26/14C08J 2363/00
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Claims

Abstract

A low density component, such as hollow microspheres, dispersed in a binder to produces a material having a surface that is comfortable to the touch even after extended exposure to an energy source, such as direct sun light.

Claims

exact text as granted — not AI-modified
1 . A material comprising:
 about 20 to less than about 60 percent of a binder;   greater than about 40 percent to about 80 percent of a low density component dispersed in the binder; and   wherein a ratio of the low density component to the binder is such that a surface of the material is comfortable to the touch after being exposed to an energy source.   
     
     
         2 . The material of  claim 1 , wherein the low density component includes hollow microspheres having an average diameter from about 4 to about 100 microns. 
     
     
         3 . The material of  claim 2 , wherein the microspheres include an average outer diameter of about 80 to about 100 microns. 
     
     
         4 . The material of  claim 2 , wherein a portion of the hollow microspheres form at least a portion of the surface of the material. 
     
     
         5 . The material of  claim 2 , wherein the microspheres include a ratio of wall thickness to sphere diameter of about 0.7. 
     
     
         6 . The material of  claim 2 , wherein the material includes about 70 to about 80 percent of the hollow microspheres. 
     
     
         7 . The material of  claim 2 , wherein the binder is a two-part epoxy resin including a base epoxy resin and a hardener. 
     
     
         8 . The material of  claim 7 , wherein the binder includes 5 parts base epoxy resin to 1 part hardener. 
     
     
         9 . The material of  claim 8 , wherein the base epoxy resin includes greater than about 50 percent of a bisphenol-A resin. 
     
     
         10 . The material of  claim 8 , wherein the hardener includes about 30 to about 50 percent of an aliphatic polyamine. 
     
     
         11 . The material of  claim 8 , wherein the material is about ⅜ inch thick. 
     
     
         12 . The material of  claim 2 , wherein the binder is selected from the group consisting of cement, urea, and urethane. 
     
     
         13 . The material of  claim 1 , wherein the low density component is a frothing agent to aerate a predetermined void space within the binder. 
     
     
         14 . The material of  claim 1 , wherein the surface of the tile remains about 100° F. or less upon extended exposure to the energy source.

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