US2011005967A1PendingUtilityA1

Methods and apparatuses for large diameter wafer handling

Assignee: ENTEGRIS INCPriority: Jan 13, 2008Filed: Jan 13, 2009Published: Jan 13, 2011
Est. expiryJan 13, 2028(~1.5 yrs left)· nominal 20-yr term from priority
H10P 72/1922H10P 72/1921H10P 72/1912H10P 72/34H10P 72/14B65D 85/70B65D 25/28B65D 43/02B65D 25/103
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Claims

Abstract

A front opening semiconductor wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. The container portion includes a means for accommodating large diameter wafers, particularly 450 mm wafers. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.

Claims

exact text as granted — not AI-modified
1 - 28 . (canceled) 
     
     
         29 . A front opening semiconductor wafer container for a stack of spaced apart, axially aligned, horizontal large diameter wafers, comprising:
 a container portion defining an open interior for containing the wafers and an open front defined by a door frame, the container portion including a plurality of wafer slots within the open interior for receiving and holding the plurality of wafers, the door frame having an upper horizontal portion with a horizontally extending slot therein and a lower horizontal portion with a horizontally extending slot therein;   a door selectively attachable seatable to the door frame to close the open front, the door having a latching mechanism selectively engageable with the door frame, an inside surface, an outside surface, a periphery, a first projection extending from the periphery of the door for being received by the horizontally extending slot in the upper horizontal portion of the door frame, a second projection extending from the periphery of the door for being received by the horizontally extending slot in the lower horizontal portion of the door frame, whereby when the door is seated to the door frame closing the open front, the door is constrained therein upwardly and downwardly.   
     
     
         30 . The front opening semiconductor wafer container of  claim 29  wherein the door frame further has a pair of vertically extending slots and the door has a cooperating pair of vertically extending projections at the periphery of the door. 
     
     
         31 . The front opening semiconductor wafer container of  claim 30  wherein the horizontal slots and vertical slot form a continuous slot around the door frame and said continuous slot has an elastomeric seal therein, the elastomeric seal extending around the entirety of the door frame. 
     
     
         32 . The front opening semiconductor wafer container of  claim 30  wherein an elastomeric seal extends around the periphery of the door and the elastomeric seal engages with the door frame when the door is seated thereto. 
     
     
         33 . A front opening semiconductor wafer container for a stack of spaced apart, axially aligned, horizontal large diameter wafers, comprising:
 a container portion defining an open interior for containing the wafers and an open front defined by a door frame, the container portion including a plurality of wafer slots within the open interior for receiving and holding the plurality of wafers horizontally, the door frame having an inwardly extending slot extending therearound;   a door selectively attachable seatable to the door frame to close the open front, the door having a latching mechanism selectively engageable with the door frame, an inside surface, an outside surface, a projection for being received by the inwardly extending slot extending around the door frame, whereby when the door is seated to the door frame closing the open front, the projection from the door into the slot on the door frame provides a structural interlacing.   
     
     
         34 . The front opening semiconductor wafer container of  claim 33  wherein one of the periphery of the door and the door frame has an elastomeric seal extending therearound for sealing engagement with the other of the door and door frame. 
     
     
         35 . A front opening semiconductor wafer container for a stack of spaced apart, axially aligned, horizontal large diameter wafers, comprising:
 a container portion defining an open interior for containing the wafers and an open front defined by a door frame, the container portion including a plurality of wafer slots within the open interior for receiving and holding the plurality of wafers;   a door selectively attachable to the door frame to close the open front, the door having a latching mechanism selectively engageable with the door frame, an inside surface, an outside surface, the door engageable with the door frame by way of a dovetail interface.   
     
     
         36 . The front opening container of  claim 35  wherein the dovetail interface is provided by a projection extending from the door projection from the door and a recess extending into the door frame.

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