Thermal module and manufacturing method thereof

Abstract

A thermal module includes a substrate and a heat pipe integrally embedded in the substrate by insert molding technique. An end of the heat pipe protrudes laterally out of the substrate. The heat pipe includes a tube, a wick structure attached to an inner surface of the tube and a working fluid filled in the tube. A method for manufacturing the thermal module includes following steps: providing a tube with a wick structure attached to an inner surface thereof, an end of the tube being open; placing the tube into a mold; injecting a molten metal into the mold to form a substrate with the tube being integrally embedded in the substrate and the open end of the tube protruding laterally out of the substrate; filling a working fluid into the tube via the open end; sealing the open end of the tube.

1 . A thermal module, comprising:
 a substrate; and   a heat pipe being integrally embedded in the substrate by insert molding technique with at least one end of the heat pipe protruding laterally out of the substrate, the heat pipe comprising a hollow tube, a wick structure attached to an inner surface of the tube and a working fluid filled in the tube.   
     
     
         2 . The thermal module of  claim 1 , wherein the substrate forms a bottom surface adapted for contacting with an electronic component, and the heat pipe is flat and forms a planar contacting surface coplanar to the bottom surface of the substrate. 
     
     
         3 . The thermal module of  claim 2 , wherein the substrate further comprises a top surface opposite to the bottom surface, a plurality of fins integrally extending upwardly from the top surface of the substrate. 
     
     
         4 . The thermal module of  claim 3 , wherein the heat pipe is U-shaped, including an evaporating section integrally embedded in the substrate and a condensing section extending through the fins. 
     
     
         5 . The thermal module of  claim 1 , wherein the substrate is rectangular, the heat pipe extends centrally through the substrate, additional two heat pipes are provided at two opposite lateral sides of the heat pipe and integrally embedded in the substrate, the additional two heat pipes each includes a linear portion and two bent portions extending slantwise from two ends of the linear portion towards corners of the substrate. 
     
     
         6 . A method of manufacturing a thermal module, comprising:
 providing a hollow tube with a wick structure being attached to an inner surface of the tube, at least one end of the tube being open;   providing a mold and positioning the tube in the mold;   injecting a molten metal into the mold to form a substrate with the tube being integrally embedded in the substrate and the at least one open end of the tube protruding laterally out of the substrate;   filling a working fluid into the tube via the at least one open end and sealing the at least one open end of the tube.   
     
     
         7 . The method of  claim 6 , wherein the substrate comprises a bottom surface and a top surface opposite to the bottom surface, a plurality of fins are integrally formed on the top surface of the substrate during the manufacturing of the substrate. 
     
     
         8 . The method of  claim 7 , wherein the heat pipe is U-shaped, including an evaporating section embedded in the substrate and a condensing section extending through the fins. 
     
     
         9 . The method of  claim 6 , wherein the substrate comprises a bottom surface, the heat pipe is flat and forms a planar contacting surface coplanar with the bottom surface of the substrate.