Vacuum vapor deposition apparatus

Abstract

In a vacuum vapor deposition apparatus including a plurality of linear-shaped vaporization sources, equal-thickness surfaces are calculated for vaporization containers, respectively. Each of the equal-thickness surfaces indicates where a deposition amount of vapor of a vaporization material released from release holes in the corresponding vaporization container is the same per unit time. Then, the vaporization containers are placed in such a manner that contact points of the respective equal-thickness surfaces all coincide with each other on a deposition surface of a substrate, each of the contact points being where the corresponding equal-thickness surfaces come in contact with the surface of the substrate.

1 . A vacuum vapor deposition apparatus in which
 a plurality of vaporization containers each containing a vaporization material and having a plurality of release holes arranged linearly are placed in parallel with arrangement directions of the plurality of release holes, and   the vaporization containers are heated to evaporate or sublimate the respective vaporization materials, and vapors of the respective materials are released through the plurality of release holes, as well as the vaporization materials are mixed together and deposited on an entire surface of a substrate by relatively moving the substrate and the vaporization containers in a direction perpendicular to the arrangement directions of the plurality of release holes, wherein:   equal-thickness surfaces are calculated for the vaporization containers, respectively, each of the equal-thickness surfaces indicating where a deposition amount of the vapor of the vaporization material released from the release holes in the corresponding vaporization container is the same per unit time; and   the vaporization containers are placed in such a manner that contact points of the respective equal-thickness surfaces all coincide with each other on the surface of the substrate, each of the contact points indicating where the corresponding equal-thickness surfaces come in contact with the surface of the substrate.   
     
     
         2 . The vacuum vapor deposition apparatus according to  claim 1 , wherein
 in a case where the vaporization containers include nozzles projecting from the vaporization containers and where the release holes are provided to penetrate through the nozzles, the vaporization containers are placed to stand vertically and the nozzles are tilted in such a manner that the contact points of the respective equal-thickness surfaces all coincide with each other on the surface of the substrate.   
     
     
         3 . The vacuum vapor deposition apparatus according to  claim 1 , wherein
 the vaporization containers each include therein a current plate having a plurality of passage holes through which the corresponding vapor passes; and   as conductance per unit length in the arrangement directions of the plurality of release holes, conductance by the passage holes is made proportional to conductance by the release holes.