Integrated circuit device

Abstract

An integrally packaged optronic integrated circuit device ( 310 ) including an integrated circuit die ( 322 ) containing at least one of a radiation emitter and radiation receiver and having top and bottom surfaces formed of electrically insulative and mechanically protective material, at least one of the surfaces ( 317 ) being transparent to radiation, and electrically insulative edge surfaces ( 314 ) having pads.

1 . A method of producing packaged optronic integrated circuit devices comprising:
 (a) providing a transparent protective layer overlying a first surface of a semiconductor wafer including a plurality of dies;   (b) providing an insulating layer overlying a second surface of the wafer and having an outer surface facing away from the wafer;   (c) forming contacts electrically connected to the dies, the contacts extending onto the outer surface of the insulating layer; and   (d) separating the dies from one another, the step of forming the contacts being performed before completion of the step of separating the dies from one another.   
     
     
         2 . A method as claimed in  claim 1  wherein the step of separating the dies from one another includes forming notches extending through the wafer between the dies before forming the contacts and severing the transparent protective layer after forming the contacts. 
     
     
         3 . A method as claimed in  claim 2  wherein the step of forming notches exposes pads of the dies in the notches and the step of forming contacts includes connecting the contacts to the pads in the notches.