Paste patterns formation method and transfer film used therein

Abstract

Disclosed is a paste pattern formation method comprising the steps of: forming a transfer pattern material on a film base material to prepare a transfer film; sticking the transfer film on a substrate on which a transfer pattern is formed so that the transfer pattern material contacts the substrate; separating the film base material from the transfer pattern material; filling a paste into the transfer pattern depression; solidifying the paste; and removing the transfer pattern material.

1 . A paste pattern formation method comprising the steps of:
 applying a transfer pattern on a film base material, wherein said transfer pattern comprises a transfer pattern material and transfer pattern depressions, thus forming a transfer film;   transferring the transfer film onto a substrate so that the transfer pattern material contacts the substrate;   separating the film base material from the transfer pattern material;   applying a paste into the transfer pattern depressions, resulting in a paste pattern;   solidifying the paste; and   removing the transfer pattern material.   
     
     
         2 . A paste pattern formation method comprising the steps of:
 applying a transfer pattern material on a film base material;   forming a transfer pattern depression(s) in the transfer pattern material, thus forming a transfer film;   transferring the transfer film onto a substrate so that the transfer pattern material contacts the substrate;   separating the film base material from the transfer pattern material;   applying a paste into the transfer pattern depression(s), resulting in a paste pattern;   solidifying the paste; and   removing the transfer pattern material.   
     
     
         3 . The paste pattern formation method according to  claim 2 , wherein the transfer pattern depression(s) are patterned with a laser. 
     
     
         4 . The paste pattern formation method according to  claim 2 , wherein the transfer pattern depression(s) are patterned by photoetching. 
     
     
         5 . The paste pattern formation method according to  claim 2 , wherein the transfer pattern depression(s) are patterned by press stamping. 
     
     
         6 . The paste pattern formation method according to  claim 1  or  2 , wherein the transfer film is adhered by pressure onto the substrate onto . which the paste pattern is formed. 
     
     
         7 . The paste pattern formation method according to  claim 1  or  2 , wherein the transfer film is adhered with an adhesive onto the substrate onto which a paste pattern is formed. 
     
     
         8 . The paste pattern formation method according to  claim 1  or  2 , further comprising a step of, after applying the paste into the transfer pattern depression(s), removing the paste remaining on the transfer pattern material. 
     
     
         9 . The paste pattern formation method according to  claim 1  or  2 , wherein the step of applying the paste into the transfer pattern depression(s) and the step of solidifying the paste are repeated two times or more until a predetermined paste pattern height is obtained. 
     
     
         10 . The paste pattern formation method according to  claim 1  or  2 , wherein the transfer pattern material is removed by dissolving with water. 
     
     
         11 . The paste pattern formation method according to  claim 10 , wherein the transfer pattern material comprises a water-soluble resin. 
     
     
         12 . The paste pattern formation method according to  claim 1  or  2 , wherein the transfer pattern material is removed by dissolving with an organic solvent. 
     
     
         13 . The paste pattern formation method according to  claim 1  or  2 , wherein the transfer pattern material is removed by baking. 
     
     
         14 . The paste pattern formation method according to  claim 1  or  2 , wherein the paste pattern is an electrode pattern of a solar cell. 
     
     
         15 . The paste pattern formation method according to  claim 1  or  2 , wherein the paste pattern is a wiring pattern of a wiring board. 
     
     
         16 . The paste pattern formation method according to  claim 1  or  2 , wherein the paste pattern is a barrier rib of a plasma display panel. 
     
     
         17 . A transfer film used in the paste pattern formation method according to  claim 1 , in which a transfer pattern depression is formed on a film base material.