Semiconductor package and production method thereof, and semiconductor device

Abstract

A semiconductor package production method includes the step of die-cutting part of a lead side portion of a seal formed by molding and dam bars using a pedestal and punch. The pedestal has an outer surface at a position retreating from a side surface of an upper seal portion as far as possible and an inner surface generally near a side surface of a lower seal portion. Width Wa of the upper surface of the pedestal is smaller than the overhang size of the upper seal portion. Tip region Ra of the lead side portion which is present right under the overhang portion of the upper seal portion has a slanted surface Fa 1 which is sloped inwardly from top to bottom.

1 - 8 . (canceled) 
     
     
         9 . A semiconductor package comprising a plurality of inner leads and a seal, the inner leads being buried in the seal, wherein:
 part of the seal which surrounds the leads includes:
 a first seal portion disposed on a first surface of the inner leads; 
 a second seal portion disposed on a second surface of the inner leads opposite to the first surface, part of the second seal portion extending outward beyond the first seal portion; and 
 a lead side seal portion disposed between the first seal portion and the second seal portion, and disposed between the inner leads, 
   an outer surface of the lead side seal portion is slanted inwardly from the second seal portion, and   a width of a tip region of the lead side portion protruding from the first seal portion is in the range of a ⅕ to ⅘ of an extending width of the second seal portion.   
     
     
         10 . A package for a semiconductor device, comprising:
 a plurality of inner leads; and   a seal for sealing the plurality of inner leads in the package, wherein:   the seal comprises:
 a first seal portion disposed on a first surface of the plurality of inner leads; 
 a second seal portion disposed on a second surface of the plurality of inner leads opposite to the first surface; and 
 a third seal portion for sealing side surfaces of the plurality of inner leads, the third seal portion being disposed between the first seal portion and the second seal portion, 
   the first, third and second seal portions are stacked in this order along a vertical direction,   the second seal portion has an extending portion extending beyond a side surface of the first seal portion in a horizontal direction perpendicular to the vertical direction,   the third seal portion has an extending portion extending beyond the side surface of the first seal portion in the horizontal direction,   the extending portion of the third seal portion has a side surface slanting inwardly to the side surface of the first seal portion,   the extending portion of the third seal portion further has a flat surface along the horizontal direction, and   a width of the flat portion is ⅕ to ⅘ of a width of the extending portion of the second seal portion.