High-performance heat dissipation substrate with monoparticle layer

Abstract

A high-performance heat dissipation substrate with monoparticle layer, including a surface plate having a first face connected to a heat source and a second face on which a heat dissipation substrate is disposed. The heat dissipation substrate is connectable to an external heat dissipation device. A thermal particle layer is disposed between the surface plate and the heat dissipation substrate in the form of a monoparticle layer. The thermal particle layer includes multiple thermal particles (ceramic materials as diamond, SiC, AIN, Single Crystal Silicon) arranged immediately adjacent to each other and partially inlaid in the surface plate and the heat dissipation substrate. The heat of the heat source can be transferred from the surface plate through the thermal particle layer to the heat dissipation substrate and dissipated outward.

1 . A high-performance heat dissipation substrate with monoparticle layer, comprising:
 a surface plate at least having a first face and a second face, the first face of the surface plate being connected to a heat source;   a heat dissipation substrate disposed on the second face of the surface plate and connected to an external heat dissipation device; and   a thermal particle layer including multiple thermal particles arranged between the surface plate and the heat dissipation substrate for transferring heat from the surface plate to the heat dissipation substrate.   
     
     
         2 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 1 , wherein the thermal particles are ceramic material particles. 
     
     
         3 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 2 , wherein the thermal particles are selected from at lest one of ceramic materials such as diamond, SiC, AIN, Single Crystal Silicon. 
     
     
         4 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 1 , wherein the thermal particles of the thermal particle layer are arranged in an array. 
     
     
         5 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 1 , wherein the thermal particles of the thermal particle layer are arranged in a non-array. 
     
     
         6 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 1 , wherein the thermal particles of the thermal particle layer are arranged in the form of a monoparticle layer. 
     
     
         7 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 1 , wherein an adhesive bonding material is filled between the thermal particles of the thermal particle layer. 
     
     
         8 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 6 , wherein an adhesive bonding material is filled between the thermal particles of the thermal particle layer. 
     
     
         9 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 7 , wherein the bonding material is formed of epoxy or epoxy added with SiC powder. 
     
     
         10 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 8 , wherein the bonding material is formed of epoxy or epoxy added with SiC powder. 
     
     
         11 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 1 , wherein two opposite sides of the thermal particles are at least partially inlaid in the surface plate and at least one heat dissipation substrate. 
     
     
         12 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 2 , wherein two opposite sides of the thermal particles are at least partially inlaid in the surface plate and at least one heat dissipation substrate. 
     
     
         13 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 3 , wherein two opposite sides of the thermal particles are at least partially inlaid in the surface plate and at least one heat dissipation substrate. 
     
     
         14 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 6 , wherein two opposite sides of the thermal particles are at least partially inlaid in the surface plate and at least one heat dissipation substrate. 
     
     
         15 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 7 , wherein two opposite sides of the thermal particles are at least partially inlaid in the surface plate and at least one heat dissipation substrate. 
     
     
         16 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 8 , wherein two opposite sides of the thermal particles are at least partially inlaid in the surface plate and at least one heat dissipation substrate. 
     
     
         17 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 9 , wherein two opposite sides of the thermal particles are at least partially inlaid in the surface plate and at least one heat dissipation substrate. 
     
     
         18 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 1 , wherein the thermal particles are arranged immediately adjacent to each other. 
     
     
         19 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 2 , wherein the thermal particles are arranged immediately adjacent to each other. 
     
     
         20 . The high-performance heat dissipation substrate with monoparticle layer as claimed in  claim 3 , wherein the thermal particles are arranged immediately adjacent to each other.