Substrate preparation using megasonic coupling fluid meniscus

Abstract

A method for cleaning a substrate is provided. The method includes receiving the substrate using a carrier that forms a circular opening, the substrate being positioned in the circular opening of the carrier. The holding of the substrate enables exposure of both a first side and a second side of the substrate at a same time. Then, moving the substrate along a direction, and while moving the substrate: (i) applying a chemistry onto the first side of the substrate, where the first side of the substrate having material to be removed; (ii) forming a fluid meniscus against the second side of the substrate at a location that is opposite a location onto which the chemistry is applied; and (iii) applying megasonic energy to the fluid meniscus while the fluid meniscus is applied against the second side. The megasonic energy increases mass transport of the chemistry to enhance removal of the material to be removed from the first side.

1 . A method for enhancing a mass transport of a chemistry in a material to be removed, the method comprising:
 applying the chemistry on the material to be removed, the material to be removed being defined on a first side of a substrate;   forming a back meniscus on a second side of the substrate opposite the applied chemistry;   applying megasonic energy to the back meniscus; and   transmitting the megasonic energy to an interface defined between the material to be removed and the first side of the substrate through the back meniscus, such that the mass transport of the chemistry through the material to be removed is enhanced.   
     
     
         2 . The method as recited in  claim 1 , wherein the operation of transmitting the megasonic energy to the interface includes:
 transmitting the megasonic energy to the substrate through the back meniscus; and   transmitting the megasonic energy to the interface through the substrate.   
     
     
         3 . The method as recited in  claim 2 , wherein the substrate attenuates the megasonic energy imparted through the back meniscus. 
     
     
         4 . The method as recited in  claim 1 , the method further comprising:
 reducing a temperature of the back meniscus.   
     
     
         5 . The method as recited in  claim 4 , wherein the operation of reducing the temperature of the back meniscus is configured to decouple a temperature of the chemistry on the first side from a temperature of a transducer generating the megasonic energy. 
     
     
         6 . A method for cleaning a substrate, comprising:
 holding the substrate using a carrier that forms a circular opening, the substrate being positioned in the circular opening of the carrier and held by supporting members secured to an inner rim of the carrier, the holding of the substrate enabling exposure of both a first side and a second side of the substrate;   applying a chemistry onto the first side of the substrate, the first side of the substrate having material to be removed;   forming a fluid meniscus against the second side of the substrate at a location that is opposite a location onto which the chemistry is applied;   applying megasonic energy to the fluid meniscus while the fluid meniscus is applied against the second side; and   wherein the megasonic energy is transmitted to an interface defined between the material to be removed and the first side of the substrate through the fluid meniscus, such that mass transport of the chemistry through the material to be removed is enhanced.   
     
     
         7 . The method as recited in  claim 6 , wherein applying the fluid meniscus against the second side of the substrate at the location that is opposite the location onto which the chemistry is applied allows for communication of energy through the substrate and to the interface. 
     
     
         8 . The method as recited in  claim 6 , wherein the substrate attenuates the megasonic energy imparted through the fluid meniscus. 
     
     
         9 . The method as recited in  claim 6 , wherein the fluid meniscus is a backside meniscus, and the chemistry is applied through delivery and removal of the chemistry in meniscus form. 
     
     
         10 . The method as recited in  claim 6 , the method further comprising:
 reducing a temperature of the fluid meniscus.   
     
     
         11 . The method as recited in  claim 10 , wherein the operation of reducing the temperature of the fluid meniscus is configured to decouple a temperature of the chemistry on the first side from a temperature of a transducer generating the megasonic energy. 
     
     
         12 . A method for cleaning a substrate, comprising:
 receiving the substrate using a carrier that forms a circular opening, the substrate being positioned in the circular opening of the carrier, the holding of the substrate enables exposure of both a first side and a second side of the substrate at a same time;   moving the substrate along a direction, while moving the substrate,
 (i) applying a chemistry onto the first side of the substrate, the first side of the substrate having material to be removed; 
 (ii) forming a fluid meniscus against the second side of the substrate at a location that is opposite a location onto which the chemistry is applied; and 
 (iii) applying megasonic energy to the fluid meniscus while the fluid meniscus is applied against the second side; 
   wherein the megasonic energy increases mass transport of the chemistry to enhance removal of the material to be removed from the first side.   
     
     
         13 . The method as recited in  claim 12 , wherein applying the fluid meniscus against the second side of the substrate at the location that is opposite the location onto which the chemistry is applied allows for communication of energy through the substrate and to the interface. 
     
     
         14 . The method as recited in  claim 12 , wherein the fluid meniscus is a backside meniscus, and the chemistry is applied through delivery and removal of the chemistry in meniscus form. 
     
     
         15 . The method as recited in  claim 12 , the method further comprising:
 reducing a temperature of the fluid meniscus.   
     
     
         16 . The method as recited in  claim 15 , wherein the operation of reducing the temperature of the fluid meniscus is configured to decouple a temperature of the chemistry on the first side from a temperature of a transducer generating the megasonic energy. 
     
     
         17 . The method as recited in  claim 12 , wherein operations (i)-(iii) are performed over a different part of the substrate as the substrate moves. 
     
     
         18 . The method as recited in  claim 17 , sensing a surface of the substrate to determine completion of the removal of the material after operations (i)-(iii) are completed for a portion of the substrate. 
     
     
         19 . The method as recited in  claim 12 , wherein the fluid meniscus is temperature controlled. 
     
     
         20 . The method as recited in  claim 12 , wherein applying megasonic energy includes coupling radio frequency power to a proximity head that provides the fluid meniscus to the second side.