Chucking System for Nano-Manufacturing

Abstract

A chucking system may include a plurality of discrete vacuum sections. The size of at least one vacuum section may be configured to be substantially similar to size of a strained region of the substrate. The strained region of the substrate is a localized deformation in the substrate due to separation force applied during a nano-imprint lithography process.

1 . A chucking system for a substrate, comprising:
 a plurality of discrete vacuum sections, size of at least one vacuum section configured to be substantially similar to size of a strained region of the substrate, wherein the strained region is a localized deformation in the substrate due to separation force applied during a nano-imprint lithography process.   
     
     
         2 . The chucking system of  claim 1 , wherein each vacuum section is configured to provide one or more chucking forces having a magnitude and direction. 
     
     
         3 . The chucking system of  claim 1 , wherein size of a plurality of vacuum sections are configured to be substantially similar to size of a strained region of the substrate. 
     
     
         4 . The chucking system of  claim 1 , wherein size and shape of at least two vacuum sections are similar. 
     
     
         5 . The chucking system of  claim 1 , wherein size and shape of at least two vacuum sections are different. 
     
     
         6 . The chucking system of  claim 1 , wherein shape of at least one vacuum section is circular. 
     
     
         7 . The chucking system of  claim 1 , wherein shape of at least one vacuum section is rectangular. 
     
     
         8 . The chucking system of  claim 1 , wherein shape of at least one vacuum section is irregular. 
     
     
         9 . The chucking system of  claim 1 , wherein the vacuum sections are configured to generate straining forces from a plurality of independently generated forces including chucking forces and variable forces with one straining force associated with each one of the discrete vacuum sections. 
     
     
         10 . The chucking system of  claim 1 , further comprising a pressure system configured to individually address each vacuum section such that differing chucking forces are associated with each vacuum section. 
     
     
         11 . A chucking system for a substrate, comprising:
 a plurality of discrete vacuum sections, size and shape of at least one vacuum section configured to be substantially similar to size and shape of a strained region of the substrate, wherein the strained region is a localized deformation in the substrate due to separation force applied during a nano-imprint lithography process.   
     
     
         12 . The chucking system of  claim 11 , wherein the shape of the vacuum section and the shape of the strained region is circular. 
     
     
         13 . The chucking system of  claim 11 , wherein the vacuum sections are configured to generate straining forces from a plurality of independently generated forces including chucking forces and variable forces with one straining force associated with each one of the discrete vacuum sections. 
     
     
         14 . The chucking system of  claim 11 , further comprising a pressure system configured to individually address each vacuum section such that differing chucking forces are associated with each vacuum section. 
     
     
         15 . A method of separating a mold from a layer disposed on a substrate, comprising:
 applying a separation force to the mold;   applying a vacuum force to the substrate through a chucking system having a plurality of discrete vacuum sections, wherein size of a first vacuum section is configured to be substantially similar to size of a strained region of the substrate, wherein the strained region is a localized deformation in the substrate due to separation force applied.   
     
     
         16 . The method of  claim 15 , wherein the first vacuum section has a vacuum associated therewith that is less than the vacuum associated remaining regions of the plurality of discrete vacuum sections. 
     
     
         17 . The method of  claim 16 , wherein the vacuum associated with the remaining regions constrains the substrate. 
     
     
         18 . The method of  claim 17 , wherein the vacuum associated with the first vacuum section deforms a region of the substrate. 
     
     
         19 . The method of  claim 15 , wherein the vacuum sections are configured to generate straining forces from a plurality of independently generated forces including chucking forces and variable forces with one straining force associated with each one of the discrete vacuum sections. 
     
     
         20 . The method of  claim 15 , wherein a pressure system is configured to individually address each vacuum section such that differing chucking forces are associated with each vacuum section.