Substrate treatment method and substrate treatment apparatus

Abstract

To improve the etch resistance of a resist pattern corresponding to an exposure light source with a short wavelength. After a resist film on a substrate is exposed to light and developed to form a resist pattern, a treatment step of supplying a fluorine-based liquid to the surface of the resist pattern is performed. Thereafter, an etching treatment of a base film using the resist pattern as a mask is performed. This increases the density of fluorine molecules on the surface of the resist pattern before the etching treatment to improve the etch resistance of the resist pattern.

1 . A substrate treatment apparatus, comprising:
 liquid supply means for supplying a fluorine-based liquid to a resist pattern and forming a protection film with a high fluorine density on a surface of the resist pattern between a developing treatment to form the resist pattern on the substrate and an etching treatment of a base film using the resist pattern as a mask.   
     
     
         2 . The substrate treatment apparatus as set forth in  claim 1 , further comprising:
 another liquid supply means for supplying another liquid containing an OH group to the resist pattern between the performance of the developing treatment and the performance of the etching treatment.   
     
     
         3 . The substrate treatment apparatus as set forth in  claim 1 , further comprising:
 energy supply means for supplying energy to the resist pattern to which the fluorine-based liquid has been supplied to accelerate the reaction of the fluorine-based liquid with the surface of the resist pattern.   
     
     
         4 . The substrate treatment apparatus as set forth in  claim 1 , further comprising:
 oxidation means for oxidizing the surface of the resist pattern before the supply of the fluorine-based liquid.   
     
     
         5 . The substrate treatment apparatus as set forth in  claim 4 ,
 wherein said oxidation means comprise:   means for housing the substrate;   oxygen-containing gas supply means for supplying an oxygen-containing gas into said container; and   ultraviolet irradiation means for applying an ultraviolet ray to the substrate in said container.