Bendable circuit structure for led mounting and interconnection

Abstract

This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection.

1 . A laminate comprising, on a substrate the following layers:
 (e) a copper or aluminum metal layer;   (f) a polyimide or adhesive layer, the metal layer being adjacent to the polyimide or the adhesive layer   (g) a copper foil layer and   (h) a liquid or film solder mask layer.   
     
     
         2 . The laminate of  claim 1  wherein the laminate is a thin polymer based copper clad filled polyimide (PI). 
     
     
         3 . The laminate of  claim 2  wherein the laminate is a CooLam™ thermal laminate. 
     
     
         4 . The laminate of  claim 3  wherein CooLam™ thermal laminate is selected from the group consisting of LC (Alumina Filled PI) and LX (Alumina Filled PI), used in conjunction with an aluminum alloy composition substrate. 
     
     
         5 . The laminate of  claim 1  wherein the laminate is LU (Anodized aluminum with adhesive) 
     
     
         6 . The laminate of  claim 1  wherein the composition of the first metal layer is aluminum. 
     
     
         7 . The laminate of  claim 1  wherein the composition of the first metal layer is copper. 
     
     
         8 . The laminate of  claim 6  or  claim 7  wherein the laminate Thickness is from about 125 microns to about 3 millimeters. 
     
     
         9 . The laminate of  claim 1  wherein the laminate is a CooLam™ laminate and the metal is Aluminum Alloy 5005. 
     
     
         10 . The laminate of  claim 1  used for LED mounting and Interconnection. 
     
     
         11 . The laminate of  claim 10  wherein the laminate is used in uses selected from the group consisting of luminaires, lamps, signs, displays and stage lighting. 
     
     
         12 . The laminate of  claim 1  wherein the copper layer is at 18 um, dielectric is at 6 um and aluminum is at 100 um. 
     
     
         13 . The laminate of  claim 1  wherein the copper is at 35 um, dielectric is at 12 um and aluminum is at 200 um to 247 um thickness. 
     
     
         14 . A “Metal Core Printed Circuit Board” made with the laminate of  claim 1 . 
     
     
         15 . The laminate of  claim 6  wherein the aluminum is anodized. 
     
     
         16 . The laminate of  claim 6  wherein the aluminum is treated with a chemical conversion coating.