heat transfer device combined a flatten loop heat pipe and a vapor chamber

Abstract

This invention declares a heat transfer device combined a flatten loop heat pipe with a vapor chamber, in which the loop heat pipe has an evaporator and a condenser, and the vapor chamber is on the evaporation part of the loop heat pipe evaporator. Metal mesh is coating on the inside surface of the vapor chamber, and coating a metal plate with vent holes on it and with supports on the both side. Working fluid is filled into the vapor chamber. Besides the advanced heat transfer characteristics of the flatten loop heat pipe, this invention has an additional advantage from the vapor chamber, which could spread the high heat flux hot spot on the chips quickly to reduce the temperature of the chips and give the chips an advantage of higher density of integration and higher running speed. Based on the combination of the loop heat pipe and the vapor chamber, changing the cooling method, using both the temperature control fins and the condenser fins, this new device could increase the temperature control accuracy and the flexibility.

1 . A heat transfer device comprising:
 a flattened loop heat pipe and a vapor chamber,   wherein the loop heat pipe has an evaporator ( 1 ) and a condenser ( 2 ), and the vapor chamber ( 3 ) is on an evaporation part ( 12 ) of the loop heat pipe evaporator ( 1 );   wherein a metal mesh ( 31 ) is disposed on an inside surface of the vapor chamber ( 3 ), and is also disposed on a metal plate ( 32 ) with vent holes, and has supports ( 34 ) on both sides; and   wherein a working fluid is in the vapor chamber ( 3 ).   
     
     
         2 . The heat transfer device recited in  claim 1  further comprising temperature control fins ( 8 ). 
     
     
         3 . The heat transfer device recited in  claim 1  wherein the condenser ( 6 ) comprises a condensing clip ring ( 61 ) and condensing fins ( 62 ), and the condensing fins ( 62 ) are located on the outside surface of the condensing clip ring ( 61 ). 
     
     
         4 . The heat transfer device recited in  claim 1  wherein the condenser ( 6 ) comprises a condensing clip plate ( 63 ) and condensing fins ( 62 ), and the condensing fins ( 62 ) are located on an outside surface of the condensing clip plate ( 63 ), which can be a one-side or double-side clip plate. 
     
     
         5 . The heat transfer device recited in  claim 4  wherein the condensing clip plate ( 63 ) is extended to the whole device, and both the temperature control fins ( 8 ) and condensing fins ( 62 ) are located on an other side of the condensing clip plates ( 63 ). 
     
     
         6 . The heat transfer device recited in  claim 2 , wherein the condenser ( 6 ) comprises a condensing clip ring ( 61 ) and condensing fins ( 62 ), and the condensing fins ( 62 ) are located on an outside surface of the condensing clip ring ( 61 ). 
     
     
         7 . The heat transfer device recited in  claim 2 , wherein the condenser ( 6 ) comprises a condensing clip plate ( 63 ) and condensing fins ( 62 ), and the condensing fins ( 62 ) are located on an outside surface of the condensing clip plate ( 63 ), which can be a one-side or double-side clip plate. 
     
     
         8 . The heat transfer device recited in  claim 7 , wherein the condensing clip plate ( 63 ) is extended to the whole device, and both the temperature control fins ( 8 ) and condensing fins ( 62 ) are located on an other side of the condensing clip plates ( 63 ).