Organic/inorganic thin film deposition device and deposition method

Abstract

Provided is a method for depositing an organic/inorganic thin film. The method includes: i) heating a source vessel containing an organic material and an inorganic material; ii) transferring a deposition gas to a process chamber; iii) distributing the deposition gas onto a substrate disposed in the process chamber; iv) purging the process chamber; v) heating an activating agent source vessel; vi) transferring a heat initiator gas phase to the process chamber; vii) distributing the heat initiator gas phase onto the organic or inorganic material monomer deposited on the substrate through the process chamber, and forming an organic/inorganic thin film; and viii) exhausting the heat initiator gas phase and purging the process chamber. Depositing the organic/inorganic thin film in a time-division manner, the thickness of the thin film can be accurately adjusted and the deposition can be uniformly performed when the thin film is deposited on a large-scale substrate.

1 . A device for depositing an organic/inorganic thin film in a time-division manner, comprising:
 a deposition unit including a process chamber, a substrate support disposed in the process chamber and supporting the substrate, a temperature adjustment unit disposed in the substrate support and adjusting the temperature of the substrate, and a shower head alternately supplying a deposition source gas phase and an activating agent source gas phase to be used for deposition of the organic/inorganic thin film onto the substrate;   a source unit including at least one deposition source vessel receiving a deposition source for supplying the deposition source gas phase to the shower head, at least one activating agent source vessel receiving an activating agent source for supplying the activating agent source gas phase to the shower head, a transfer gas supply source supplying a transfer gas for transferring the deposition source gas phase to the process chamber, a diluted gas supply source supplying a diluted gas to the process chamber, a heating unit heating the deposition source vessel and the activating agent source vessel so as to generate the deposition source gas phase from the deposition source vessel and the activating agent gas phase from the activating agent source vessel, and a plurality of transfer paths allowing the deposition source gas phase and the activating agent source gas phase to be selectively transferred to the shower head based on the time division and being heated by the heating unit;   a flow adjustment unit introducing the deposition source gas phase for organic/inorganic materials, the activating agent source gas phase, the transfer gas and the diluted gas into the process chamber, and adjusting the amount and speed of the deposition source gas phase for organic/inorganic materials, the activating agent source gas phase, the transfer gas, and the diluted gas;   a plurality of valves disposed in the respective transfer paths for time-dividing the deposition source gas phase for organic/inorganic materials, the activating agent source gas phase, the transfer gas, and the diluted gas to be introduced into the process chamber; and   a vacuum pump making a vacuum state of the process chamber constant.   
     
     
         2 . The device according to  claim 1 , wherein the shower head is comprised of a plurality of plates, and includes at least one hole having a diameter of 0.01 mm to 50 mm. 
     
     
         3 . The device according to  claim 2 , wherein the shower head is made of stainless steel or quartz which is not deformed at a high temperature. 
     
     
         4 . The device according to  claim 2 , wherein a removable shower curtain is disposed in the shower head along a radius direction of the shower head. 
     
     
         5 . The device according to  claim 1 , wherein the deposition source vessels and the activating agent source vessels are used for forming a multi-component organic/inorganic thin film.