Energy transducing apparatus and energy transducing equipment
Abstract
The invention discloses an energy transducing apparatus and an energy transducing equipment grouping a plurality of the energy transducing apparatuses. The energy transducing apparatus includes a heat pipe, a first heat-dissipating member, a second heat-dissipating member, and an energy transducing member. The heat pipe includes a contact portion and a flat portion. The first heat-dissipating member includes a plurality of fins. The second heat-dissipating member is connected to the first heat-dissipating member to form an accommodating space. The contact portion is accommodated in the accommodating space and contacts both the first heat-dissipating member and the second heat-dissipating member. The energy transducing member contacts the flat portion. Thereby, heat generated in operation by the energy transducing member is conducted through the flat portion to the heat pipe and then is dissipated through the first heat-dissipating member, the second heat-dissipating member, and the fins.
Claims
exact text as granted — not AI-modified1 . An energy transducing apparatus, comprising:
a heat pipe comprising a contact portion and a flat portion, wherein the contact portion extends along a direction; a first heat-dissipating member comprising a plurality of first fins, wherein the first fins are parallel to the direction substantially; a second heat-dissipating member connected to the first heat-dissipating member to form an accommodating space, the contact portion being accommodated in the accommodating space and contacting both the first heat-dissipating member and the second heat-dissipating member; and an energy transducing member contacting the flat portion,
wherein the first heat-dissipating member comprises a first semi-groove along the direction, the second heat-dissipating member comprises a second semi-groove along the direction, and the first semi-groove and the second semi-groove form the accommodating space.
2 . The energy transducing apparatus of claim 1 , wherein the second heat-dissipating member comprises a plurality of second fins parallel to the direction substantially.
3 . The energy transducing apparatus of claim 1 , wherein the second heat-dissipating member comprises a circuit accommodating space for accommodating a control module circuit for controlling the energy transducing member.
4 . The energy transducing apparatus of claim 3 , further comprising a connector, the connector being exposed to the second heat-dissipating member and being electrically connected to the control module circuit.
5 . The energy transducing apparatus of claim 3 , wherein the second heat-dissipating member comprises a tubular body, a front cover and a back cover, the front cover and the back cover are engaged to two sides of the tubular body for forming the circuit accommodating space.
6 . The energy transducing apparatus of claim 1 , wherein the first heat-dissipating member and the second heat-dissipating member press the contact portion tightly.
7 . The energy transducing apparatus of claim 1 , wherein the energy transducing member comprises an energy transducing semiconductor structure, a substrate, and a base, the energy transducing semiconductor structure is disposed on the substrate, and the base is connected to the substrate such that the energy transducing semiconductor structure is exposed.
8 . The energy transducing apparatus of claim 7 , wherein the energy transducing semiconductor structure is formed on the substrate.
9 . The energy transducing apparatus of claim 7 , wherein the energy transducing semiconductor structure is a chip and is mounted on the substrate.
10 . The energy transducing apparatus of claim 7 , wherein the energy transducing semiconductor structure is a light-emitting diode semiconductor structure or a solar cell semiconductor structure.
11 . The energy transducing apparatus of claim 7 , wherein the base comprise a first sunken portion and a second sunken portion connected to the first sunken portion, the substrate contacts the flat portion and is connected to the second sunken portion, and the energy transducing semiconductor structure is exposed to the first sunken portion.
12 . The energy transducing apparatus of claim 1 , wherein the energy transducing member comprises an energy transducing semiconductor structure and a base and the energy transducing semiconductor structure is on the base.
13 . The energy transducing apparatus of claim 12 , wherein the base comprises a recess and the energy transducing semiconductor structure is in the recess.
14 . The energy transducing apparatus of claim 12 , wherein the energy transducing semiconductor structure is formed on the base.
15 . The energy transducing apparatus of claim 12 , wherein the energy transducing semiconductor structure is a chip and is mounted on the base.
16 . The energy transducing apparatus of claim 12 , wherein the energy transducing semiconductor structure is a light-emitting diode semiconductor structure or a solar cell semiconductor structure.
17 . The energy transducing apparatus of claim 1 , further comprising a carrier, the carrier being connected to the heat pipe, wherein the energy transducing member is mounted on the carrier, so that the energy transducing member contacts the flat portion.
18 . The energy transducing apparatus of claim 17 , further comprising an optical adjusting member connected to the carrier.
19 . The energy transducing apparatus of claim 18 , wherein a side of the carrier comprises a screw thread structure, so that the optical adjusting member is screwed on the carrier through the screw thread structure.
20 . The energy transducing apparatus of claim 18 , wherein the optical adjusting member hooks the carrier by a hooking structure.
21 . The energy transducing apparatus of claim 18 , wherein the optical adjusting member comprises a lens structure right opposite to the energy transducing member.
22 . An energy transducing equipment, comprising:
a frame comprising a panel, the panel comprising a plurality of holes; and a plurality of energy transducing apparatuses disposed on the frame, each of the energy transducing apparatuses corresponding to one of the holes and comprising: a heat pipe comprising a contact portion and a flat portion, wherein the contact portion extends along a direction; a first heat-dissipating member comprising a plurality of first fins, wherein the first fins are parallel to the direction substantially; a second heat-dissipating member connected to the first heat-dissipating member to form an accommodating space, the contact portion being accommodated in the accommodating space and contacting both the first heat-dissipating member and the second heat-dissipating member; and an energy transducing member contacting the flat portion,
wherein the first heat-dissipating member comprises a first semi-groove along the direction, the second heat-dissipating member comprises a second semi-groove along the direction, and the first semi-groove and the second semi-groove form the accommodating space.
23 . The energy transducing equipment of claim 22 , wherein each of the energy transducing apparatus comprises a carrier connected to the heat pipe and the energy transducing member is mounted on the carrier, so that the energy transducing member contacts the flat portion.
24 . The energy transducing equipment of claim 23 , wherein each of energy transducing equipment comprises an optical adjusting member, the carrier comprises a screw thread structure exposed to the corresponding hole, and the optical adjusting member is screwed on the carrier through the screw thread structure.
25 . The energy transducing equipment of claim 22 , further comprising a control module circuit, the control module circuit being disposed on the frame and being electrically connected to the energy transducing apparatuses.Join the waitlist — get patent alerts
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